Portland, Oregon – July 6, 2011
Xpeedic Technology presents a technical paper at the international conference InterPACK 2011 (http://www.asmeconferences.org/InterPACK2011/) being held July 6-8 in Portland, Oregon. Dr. Feng Ling, CEO of Xpeedic Technology, Inc., presents the paper co-authored by Xpeedic Technology, Inc. and Jiangsu Changjiang Electronics Technology Co., Ltd.
Paper: Signal Integrity Analysis for RF System-in-Package Designs
Authors: Feng Ling, Xpeedic Technology, Inc.
Jeff Chen, Jiangsu Changjiang Electronics Technology Co., Ltd
Weiping Li, Jiangsu Changjiang Electronics Technology Co., Ltd
Session: 8-2 Electrical Analysis of Microelectronic Packages – II
When: 2:15 – 3:30 PM, Wednesday, July 6, 2011
Where: Marriott Portland Downtown Waterfront 1401 SW Naito Parkway Portland, OR 97201
The InterPACK conference is the flagship technical meeting of the ASME Electronic and Photonic Packaging Division (EPPD), with the participation of JSME, IEEE-CPMT, and iNEMI.