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SMIC 2016 Technology Symposium in Shanghai

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Date: Sept. 1, 2016.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2016 Technology Symposium in Shanghai on Sept, 1, 2016.

As SMIC dedicated IPD IP vendor, Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service.

Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

Please come to our booth for further discussion if you have any interest.

For more details, please visit http://service.smics.com/symposium/website/CN/en/index.jsp

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“Four Steps to solve high-speed signal integrity issue”Seminar

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Time
August 5, 2016, Friday 10: 00-16: 00

location
Shanghai ICC Center conference room

Address
No.2388 ZhangDong Road, Bldg 21, Pudong, Shanghai

Agenda

From To Topics
1000 1010 Opening
1010 1040 High Speed SI solution overview
1040 1120 S parameter in high speed digital design
1120 1150 Via modeling and simulation in high speed digital design
1150 1320 Lunch Time
1320 1350 Cadence Allegro layout secrets
1350 1420 Impedance Discontinuities From Surface Mounted Pads
1420 1440 Coffee Break
1440 1510 High Speed Channel Modeling And Optimization
1510 1540 SI real case study
1540 1600 Q&A and lucky draw

Organizer
Shanghai Integrated Circuit Technology and Promotion Center
Xpeedic Technology Co.,Ltd.

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