EDICON2017

Xpeedic to Exhibit at EDI CON China 2017

Date: Apr 25-27, 2017.
Location: Shanghai, China
Booth: 360

EDI CON is an opportunity for design engineers and system integrators to learn about the latest RF/microwave and high speed digital products and technologies for today's communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. With a focus on applications, emerging technologies and practical engineering solutions, this annual event brings together the designers at the forefront of Chinese innovation and the world's leading multi-national technology companies. EDI CON includes keynotes presentations from industry executives and government officials, technical presentations, workshops, expert panels, exhibitor showcase and networking reception. The three day event will be held April 25-27, 2017 at the Shanghai Convention & Exhibition Center of International Sourcing in Shanghai, China.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

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More details to see http://www.ediconchina.com/default.asp

workshop

SMIC Advanced Technology Workshops

Time & Location

  • Thursday, April 13, 2017 in Shanghai
  • Tuesday, April 18,2017 in Santa Clara

The 2017 SMIC Advanced Technology Workshops will be organized in Shanghai, and Santa Clara, CA during the months of April 2017.

Xpeedic Technology will demonstrate its latest development EDA solution and IP solution as one of the valuable partners then. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

SMIC Workshop 1_ENSMIC Workshop 2_EN

eda

Training Program

尊敬的工程师伙伴,

《芯禾科技EDA培训系列课程》又推出了最新一期的劲爆课程:本期课程将围绕射频芯片设计,和大家一起探讨“多种工艺下的无源结构快速仿真与建模技术”。

先进工艺下的无源结构建模、无源结构的仿真优化向来是射频芯片设计的热点,本期课程将针对“先进工艺带来的好处与设计挑战、无源结构的设计要点、Pcell快速创建技术,等效电路快速创建技术”等大家所关心的技术要点进行详细的剖析与交流。

课程将由芯禾科技资深技术支持陈威和翁寅飞讲师领衔主讲,对购买了芯禾科技EDA工具的客户免费开放(每个License限报名两人),也欢迎其他有兴趣的工程师报名参加。

机会难得,欢迎大家报名和专家面对面交流!

苏州芯禾电子科技有限公司

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  • 时间:2017年4月7日 周五 10:00-16:00
  • 地点:祖冲之路2290弄展想广场1号楼1101室(近2号线广兰路站)
  • 适用对象:从事射频芯片设计以及模拟、混合信号设计的工程师
  • 培训联系人:Max Cang (wei.cang@xpeedic.com)
  • 日程安排:

培训日程安排表格

点击这里,在线报名!

IC设计论坛

Tech Shanghai 2017

日期:2017年3月23日

地点:上海,长荣桂冠酒店

在竞争日趋激烈的IC设计行业,任何一次技术升级都将引起行业洗牌,而作为企业中流砥柱的工程师,提高自身设计能力是永恒的话题。

本论坛邀请了海内外领先EDA、IP、测试等厂商(Xpeedic芯禾科技、Altium、Cadence、Keysight、Kilopass、芯愿景等)的技术专家出席,关注IC设计的您怎能错过?

1. 演讲议程

IC

*主办单位保留修改议程之权利,会议议程以本次活动现场为准。

X展架

2. 现场大奖

有机会赢取Ipad min2 、Apple Watch Series 1 各一台!

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3. 业界大厂出席

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4. 报名

点击“http://survey.eet-china.com/669433”即可抢先报名,组团参会领队更有精美礼品!

台湾培训

Training Program

尊敬的工程师伙伴,

《Xpeedic EDA 培训系列课程》隆重登陆台湾!在台北举行的首次课程将围绕高速数位设计,和大家一起探讨“基于 100GBase-KR4 协议的全通道建模与优化”。课程中将集中展示“25G链路中过孔建模和优化、传输线建模和优化、材料选型、连接器选型等设计要点”,介绍如何进行基于 100GBase-KR4 协议的全通道建模与优化。

此次课程将由 Xpeedic 资深技术支持赵晨星讲师领衔主讲。机会难得,欢迎大家报名和专家面对面交流!(名额有限,报满立刻截止)

芯禾科技

课程精彩内容

  • IEEE 802.3bj(100GBase-KR4)系统规范介绍
  • Via的快速建模与优化
  • Transmission Line的快速建模与优化
  • Cable的快速建模与优化
  • 全通道的快速建模与优化

课程安排

时间:2017年3月23 日 周四 10:00-16:00

地点:台北市忠孝东路三段197号旁(台北科技大学 亿光大楼)

培训费用:免费

培训联系人:marketing@xpeedic.com

请发送邮件至“marketing@xpeedic.com”进行报名,并标注“公司+姓名+职位+人数+手机+邮箱地址”