EDICON2017

Xpeedic to Exhibit at EDI CON China 2017

Date: Apr 25-27, 2017.
Location: Shanghai, China
Booth: 360

EDI CON is an opportunity for design engineers and system integrators to learn about the latest RF/microwave and high speed digital products and technologies for today’s communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. With a focus on applications, emerging technologies and practical engineering solutions, this annual event brings together the designers at the forefront of Chinese innovation and the world’s leading multi-national technology companies. EDI CON includes keynotes presentations from industry executives and government officials, technical presentations, workshops, expert panels, exhibitor showcase and networking reception. The three day event will be held April 25-27, 2017 at the Shanghai Convention & Exhibition Center of International Sourcing in Shanghai, China.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

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More details to see http://www.ediconchina.com/default.asp