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Xpeedic to Exhibit at DesignCon 2019

Date: Jan.29-31, 2019

Location: Santa Clara, CA

Booth#: 525

Xpeedic Technology, Inc. will exhibit at DesignCon 2019 at Santa Clara on Jan.29-31, 2019.

DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.

At Booth 525, Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

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Register now and use our promo code SPECIAL for a free Expo Pass &20% off any conference Pass!

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ICCAD 2018

Xpeedic to Exhibit at ICCAD 2018

Date: Nov.29-30, 2018

Location: Zhuhai, China

Booth#: 003-004

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2018 Annual Conference & Zhuhai IC Industry Innovation and Development Summit (ICCAD 2018) in Zhuhai on Nov.29-30, 2018.

ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain to exchange their expertise and to build up networks. This year, the theme is “Linking Core Power, Leading intelligence of the Great Bay Area”. In this annual general meeting, the Integrated Circuit industry, especially the opportunities and challenges faced by the IC Design industry, will be discussed in details in order to enhance innovation capability and improve the comprehensive capability of Chinese Integrated Circuit industrial chain, thereby satisfying the market demands and boosting international competence.

At booth 003-004 , Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

Dr. Wenliang Dai, co-founder, VP Engineering, will also present the leading design method “Addressing Modeling and Simulation Challenges for IC, Package and System” within EDA and IC Design Service forum on Nov.30.

For more details, please click here.

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Xpeedic to Exhibit at TowerJazz TGS2018 US

Date: November 7, 2018

Place: Santa Clara, US

 

As a valuable TowerJazz EDA partner, Xpeedic Technology will showcase its latest solutions at TGS 2018 (TowerJazz Technical Global Symposium) in Santa Clara, November 7, 2018.

Featured as in-booth demos will include

TowerJazz AD_V3

  • Combined IRIS-HFSS Flow for Passive Modeling and Verification in Advanced TowerJazz RF and high performance analog process nodes.

This flow is seamlessly integrated in Cadence Virtuoso platform, and gives IC designers not only the fast and accurate passive modeling and synthesis capability at the design stage with Xpeedic accelerated Method of Moments (MoM) solver engine and artificial neural network(ANN) technique , but also the verification capability enabled by HFSS at the sign-off stage.

  • Integrated Passived Device Technology for RF Front End Design

IPD is a core technology for implementing highly integrated RF front-end modules. Utilizing high-resistance silicon and thick copper processes, IPD has both consistency and high integration of semiconductor process, and good RF performance similar to traditional thick film processes such as LTCC. With its unique IPD design methodology and process, Xpeedic has developed a series of filters, duplexers, couplers, power dividers and other devices, which are widely used in antenna switch modules, power amplifier modules and other RF front-end modules.

  • IPD-enabled System-in-Package for Integrated System

SiP technology can integrate multiple chips of different processes (CMOS, SOI, GaAs, etc.) and different functions (digital, analog, RF, etc.) into one package, achieving the advantages of miniaturization, high performance and low cost. Xpeedic can also integrate its unique IPD into SiP and achieve even higher integration. Thanks to its proprietary EDA tools, dedicated IPD/SiP design teams, wafer and packaging partners, the company is able to provide customers with one-stop SiP solutions and services.

TGS is an annual global event, which facilitates customer and partner interaction with TowerJazz team and industry executives to exchange information on the latest unique and advanced solutions for next-generation ICs in today’s growing markets such as consumer, industrial, automotive, medical and aerospace and defense.

For more information, please visit here.

GTC China 2018

Xpeedic to Exhibit at GTC China 2018

Date: November 1, 2018

Place: Shanghai, China

As a valuable GLOBALFOUNDRIES EDA partner, Xpeedic Technology will showcase its latest solutions at GTC China 2018 (GLOBALFOUNDRIES Technology Conference) in Shanghai, November 1, 2018.

Featured as in-booth demos will include

GTC AD

  • Combined IRIS-HFSS Flow for EM simulation in GLOBALFOUNDRIES Process Nodes

This flow is seamlessly integrated in Cadence Virtuoso platform, and gives IC designers not only the fast and accurate passive modeling and synthesis capability at the design stage with Xpeedic accelerated Method of Moments (MoM) solver engine and artificial neural network(ANN) technique , but also the verification capability enabled by HFSS at the sign-off stage.

  • Integrated Passived Device Technology for RF Front End Design

IPD is a core technology for implementing highly integrated RF front-end modules. Utilizing high-resistance silicon and thick copper processes, IPD has both consistency and high integration of semiconductor process, and good RF performance similar to traditional thick film processes such as LTCC. With its unique IPD design methodology and process, Xpeedic has developed a series of filters, duplexers, couplers, power dividers and other devices, which are widely used in antenna switch modules, power amplifier modules and other RF front-end modules.

  • IPD-enabled System-in-Package for Integrated System

SiP technology can integrate multiple chips of different processes (CMOS, SOI, GaAs, etc.) and different functions (digital, analog, RF, etc.) into one package, achieving the advantages of miniaturization, high performance and low cost. Xpeedic can also integrate its unique IPD into SiP and achieve even higher integration. Thanks to its proprietary EDA tools, dedicated IPD/SiP design teams, wafer and packaging partners, the company is able to provide customers with one-stop SiP solutions and services.

For more information, please visit here.

Banner-RFwave

Xpeedic Joins GLOBALFOUNDRIES RFwave Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5G

Cupertino, CA. — October 12, 2018 —Xpeedic Technology, Inc. and GLOBALFOUNDRIES today announced the addition of Xpeedic Technology to GF’s RFwave Partner Program.

The RFwave Partner Program builds upon GF’s industry-leading radio frequency (RF) solutions, such as FD-SOI, RF CMOS (bulk and advanced CMOS nodes), RF SOI and silicon germanium (SiGe) technologies. The program provides a low-risk, cost-effective path for designers seeking to build highly optimized RF solutions for a range of wireless applications such as IoT across various wireless connectivity and cellular standards, standalone or transceiver integrated 5G front end modules, mmWave backhaul, automotive radar, small cell and fixed wireless and satellite broadband.

“Xpeedic is excited to join GF’s RFwaveTM Partner Program. This partnership enables our mutual customers to design RF silicon and system with confidence by adopting Xpeedic’s foundry-proven EDA tools, IRIS, which has been certified in GLOBALFOUNDRIES’ 22FDX® process technology, and unique passive integration solution for RF front end module design. ”said Dr. Feng Ling, CEO of Xpeedic Technology, “The RFwave program is a great platform to give RF design community access to a broad set of innovative RF solutions developed on GF’s industry-leading RF technology platform by the RFwave members.”

“As the RFwave program continues to expand, partners play a critical role in helping to serve our growing number of clients and extend the reach of our RF ecosystem by providing innovative RF-tailored solutions and services,” said Mark Ireland, vice president of ecosystem partnerships at GF. “These new partners will help drive deeper engagement and enhance technology collaboration, including tighter interlock around quality, qualification and development methodology, enabling us to deliver advanced highly integrated RF solutions.”

GTC2018

Xpeedic to Exhibit at GTC USA 2018

Date: September 25, 2018

Place: Santa Clara, CA

As a valuable GLOBALFOUNDRIES EDA partner, Xpeedic Technology will showcase its latest solutions at GTC USA 2018 (GLOBALFOUNDRIES Technology Conference) in Santa Clara, September 25, 2018.

Featured as in-booth demos will include

GTC AD

  • Combined IRIS-HFSS Flow for EM simulation in GLOBALFOUNDRIES Process Nodes

This flow is seamlessly integrated in Cadence Virtuoso platform, and gives IC designers not only the fast and accurate passive modeling and synthesis capability at the design stage with Xpeedic accelerated Method of Moments (MoM) solver engine and artificial neural network(ANN) technique , but also the verification capability enabled by HFSS at the sign-off stage.

  • Integrated Passived Device Technology for RF Front End Design

IPD is a core technology for implementing highly integrated RF front-end modules. Utilizing high-resistance silicon and thick copper processes, IPD has both consistency and high integration of semiconductor process, and good RF performance similar to traditional thick film processes such as LTCC. With its unique IPD design methodology and process, Xpeedic has developed a series of filters, duplexers, couplers, power dividers and other devices, which are widely used in antenna switch modules, power amplifier modules and other RF front-end modules.

  • IPD-enabled System-in-Package for Integrated System

SiP technology can integrate multiple chips of different processes (CMOS, SOI, GaAs, etc.) and different functions (digital, analog, RF, etc.) into one package, achieving the advantages of miniaturization, high performance and low cost. Xpeedic can also integrate its unique IPD into SiP and achieve even higher integration. Thanks to its proprietary EDA tools, dedicated IPD/SiP design teams, wafer and packaging partners, the company is able to provide customers with one-stop SiP solutions and services.

For more information, please visit here.

Banner-XTUG2018

XTUG 2018

亲爱的工程师伙伴,

2018年的上半年,社会对于拥有质量过硬的“中国芯”的呼吁之声达到了产业发展有史以来的最高点。我们都知道,在一块芯片制造出来之前,芯片设计尤为重要,而芯片设计的根基则是电子设计自动化(EDA)软件。我们从未对国产高质量EDA软件产生过如此迫切的需求。

2018年9月20日,国内EDA、IPD、SiP行业的领军企业芯禾科技一年一度的用户大会XTUG(Xpeedic Technology Users Group)将秉承一贯的传统, 再次跟您相会。这不仅是一场知识碰撞的盛会、经验交流的盛会、战略共享的盛会,也是一场对于多年来一直支持和信任芯禾科技的新老用户和有识之士的答谢盛宴,我们发展的路上感谢有您的陪伴!

诚邀您莅临上海博雅酒店,与芯禾科技高层领导、技术专家、生态系统合作伙伴以及行业客户菁英一起,畅享行业智慧,探讨“中国智能时代”的设计创新。

活动安排

  • 时间:2018年9月20日
  • 地点:上海博雅酒店——浦东新区张江碧波路699号(近晨晖路) 碧波厅
  • 交通:地铁二号线张江高科站5号出口
  • 日程*:

*具体内容以大会实际安排为准

虚位以待,唯待君来。XTUG2018,我们不见不散!