Xpeedic to Present Two Papers at IEEE EMC+SIPI 2018

Date: 7/30-8/3, 2018

Location: Long Beach, CA, US

Xpeedic will participate in the 2018 IEEE Symposium on Electromagnetic Compatibility and Signal, Power Integrity (EMC+SIPI) held at Long Beach Convention Center in California, USA on July 30-Aug 3, 2018.

Xpeedic has two papers accepted after a rigorous peer review process and will present them at the following time slots:

Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

  • Time: 7/31 4:00PM
  • Author: Feng Ling (Xpeedic Technology); Kevin Cai (Cisco Systems, US); Bidyut Sen (Cisco Systems, US)

An Empirical Model for Foamed High-Speed Cable

  • Time: 8/2 4:00PM
  • Author: Xin Wu (Wandtec (Shenzhen) Optronics Technology); Feng Ling (Xpeedic Technology)

We look forward to meeting you there.

For more details, please click here.


Xpeedic to Present at Samsung Foundry’s DAC Theater

Date: June 25 Monday 3:30pm

Place: San Francisco, CA, US

As a partner of Samsung Advanced Foundry Ecosystem (SAFE) program, Xpeedic is invited to present at Samsung Foundry’s DAC 2018 Theater. Dr. Feng Ling, Founder and CEO of Xpeedic, will give the presentation titled  Accurate Passive Modeling and Simulation for Advanced Process Nodes  at Samsung’s booth.


As we move to advanced process nodes, electromagnetic simulation of passives and interconnects becomes challenging for IC designers. In the presentation, Xpeedic IRIS flow with seamless integration in Cadence Virtuoso platform will be demonstrated. At the design stage, IRIS and iModeler enable fast passive modeling and synthesis with its accelerated Method of Moments (MoM) solver engine and artificial neural network(ANN) technique. Through the collaboration between Xpeedic and Ansys, IRIS has a direct link to Ansys’s 3D Finite Element Method (FEM) based HFSS to enable passive simulation verification at the signoff stage. This link also makes the simulation of arbitrarily shaped 3D structures and IC-package co-simulation possible.


During DAC 2018, Xpeedic will bring a series of demos covering simulation from IC, package, to system at its DAC booth# 2041, including the IRIS flow for passive modeling and simulation in advanced nodes, IRIS for both high-resistivity silicon (HRSi) and through-glass-via (TGV) based IPD design, Hermes for 3D package simulation, and expert-series signal integrity tools for high speed systems.


We look forward to meeting you there.


Xpeedic’s IRIS Certified for EM Simulation in GF 22FDX Process

Cupertino, CA. — June 12, 2018 —Xpeedic Technology, Inc. today announced that its 3D full-wave electromagnetic (EM) simulation tool, IRIS, has been certified in GLOBALFOUNDRIES’ 22FDX® process technology. This certification enables designers to run IRIS with confidence using the certified IRIS process file available in GF’s 22FDX PDK.

Xpeedic’s IRIS is empowered by an accelerated Method of Moments solver engine to achieve both accuracy and scalability for large-scale structures. For advanced nodes, it takes into account the width- and spacing-dependent process variations such as resistance table and bias table. As a result, IRIS is able to capture the conductor skin effect and proximity effect to accurately simulate passive components like inductors and MOM (metal-oxide-metal) capacitors. Xpeedic has done extensive simulation on various inductors and MOM capacitors with different process stack options. Excellent correlation with silicon measurement has been achieved.

“We are very pleased that IRIS is able to achieve excellent correlation with measurement and thus certified for GF’s 22FDX process,” said Dr. Feng Ling, CEO of Xpeedic Technology, “With its powerful EM solver engine and seamless integration in design environment, IRIS can greatly help IC designers to shorten the design cycles and achieves first-pass silicon success.”

The electromagnetic certification program by GF ensures that every EM tool certified by the program meets the highest quality standards. With this certification, IC designers can choose their preferred EM simulation tool and its corresponding process file to ensure their design confidence and reduce time-to-market.