Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming. Hermes provides a fast and accurate way to simulate PCB board and package structure of signal integrity problems, such as insertion loss, return loss, crosstalk, etc., also allows the designer to simulate and track processing for post-layout. Hybrid algorithm have a very fast speed in the premise of ensuring the accuracy of the results, which greatly improve the efficiency of the simulation. The powerful parametric sweeping function can be made by changing the properties of the pad, the stackup, the trace layer and the depth of the back hole, and the results can be easily compared with others. By using the unique electromagnetic field simulation engine, the S parameters can be extracted efficiently and accurately, and update the physical parameters such as the length, width, distance, and stackup to optimize the design. Hermes also provides the feature of exporting to HFSS, which can be used to quickly create models.
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