Xpeedic IRIS Plus provides a 3D EM simulation tool of passive devices and interconnect structures for RF/microwave chips, modules, packages, and circuit boards. Industry leading multi-layer structure of the method of acceleration technology, fast and accurate simulation of complex electromagnetic effects, including the skin effect of the conductor, proximity effect and multiple dielectric loss. IRIS Plus support multi-thread calculation, its solver greatly reduce the EM simulation time, improve the design efficiency. IRIS Plus support import IRIS project file, GDS, DXF file, also integrate RFIC template modeling, and RFPCB template modeling. The IRIS Plus design flow will greatly reduce the IC design time of RFIC designer.
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