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Xpeedic to Exhibit at IMS2019

Date: June 2-7, 2019

Place: Boston, US

Booth#: 210


Xpeedic Technology will showcase its latest solutions at the 2019 IEEE MTT-S International Microwave Symposium (IMS) in Boston Convention & Exhibition Center, June 2-7.

Featured as in-booth demos will include

  • IRIS, Virtuoso-integrated EM simulation tool with the state-of-the-art 3D planar solver

Certified on multiple foundries’ advanced process nodes and proven on RF IC designs including 5G mmWave.

  • Metis, IC-package co-simulation tool

IC-package co-simulation tool to enable system-in-package designs. It also supports advanced packaging technologies such as 2.5D interposer with TSV.

  • IPD for RF FE module design

Advanced IPD technology to enable passive integration for RF front end, helping customers to achieve faster design convergence from spec to volume production.

  • Through Glass Via (TGV) solution in collaboration with Corning

Through Glass Via technology has become a promising technology candidate to realize integrated, low cost and high performance passive devices. A diplexer built with TGV shows less in-band insertion loss and greater out-of-band rejection yet still compact size.


Xpeedic will also present at IMS MicroApps Theatre

* Title: Integrated Passive Devices (IPD) for RF Front End Integration (WEMA35)

* Time: June 5, 12:30-12:45

See the event details here.

IMS2019-2

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Xpeedic to Exhibit at DAC2019

Date: June 2-6, 2019

Place: Las Vegas, NV, US

Booth#:622

Xpeedic Technology will showcase its latest solutions at the 2019 Design Automation Conference (DAC) in Las Vegas, June 2-6.

Xpeedic 5G solution enables designers inSoC, RFIC, packaging, board to build better 5G systems with theirdifferentiating technologies. It includes the following highlights:

dac-5g

5G RFIC in Advanced Process Nodes
  • IRIS,Virtuoso-integrated EM simulation tool with the state-of-the-art 3D planar solver, certified on multiple foundries’ advanced process nodes and proven on RF IC designs including 5G mmWave.

IC-Package Co-design for 5G Application
  • Metis,IC-package co-simulation tool to enable 5G system-in-package designs, and supports advanced packaging technologies for CPU, GPU, network processor, FPGA designs to enable artificial intelligence applications in 5G era.

Integrated Passive Devices for 5G NR
  • RF front end module has become more and more complicated with mobile technology evolving from 2G, 3G, 4G to 5G. Increasing number of bands, carrier aggregation, and MIMO demand more filters and more integration in RF front end. Integrated passive devices (IPD) provide great advantages of miniaturization, high consistency, low cost and high integration over discrete. Xpeedic has partnered with industry leading IPD foundries with both silicon and glass substrates. With the extensive IPD design experience,Xpeedic helps customers to choose the right technology to meet their spec.

More details to see here.