DesignCon2019

芯禾科技DesignCon2019 SI技能秀

 

尊敬的工程师伙伴,
我们盛情邀请您参加本月底芯禾科技在美国Santa Clara 2019年DesignCon展会上现场举行的高速SI技能秀活动。

我们一共准备了八大热门话题,由业内专家现场为您演示并互动讨论。所有参加者,皆有机会获得芯禾科技为您准备的新年礼物一份。

Signal Integrity Demo Highlights

 

  • IEEE P370 compatible de-embedding and quality check for measured S-parameters up to 50GHz
  • Through-Only De-embedding (TOD) and optimization based Dk/Df extraction for high-speed and wideband applications
  • Quick via modeling and optimization from connector footprint
  • Fast SI/PI simulation of 2.5D interposer with TSV
  • Fast and accurate fiber weave modeling and simulation
  • Automated crosstalk scan, impedance scan and DRC+ for signal integrity signoff
  • Automated full channel crosstalk analysis and design margin evaluation for high speed backplane systems
  • Web-based passive model management for SI/PI engineers

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MEET US AT

DesignCon2019   |    Booth 525

请点击“Sign Up”,选择您感兴趣的主题,报名留位

QQ图片20190107164618

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