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Accurate Dk/Df Extraction for High-speed SI Applications

This application note presents an accurate way to perform dielectric constant (Dk) and dielectric loss (Df) extraction over a wide range of laminate materials for high-speed SI applications. The Through-Only De-embedding (TOD) method with optimization is used for this Dk/Df extraction. The resultant frequency dependent material models is ready to be used in electromagnetic simulation tools in market.

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