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The growing demands of 5G, edge computing and an evolving cloud require the datacenter with faster and more reliable high speed performance.
Channel performance is known as the bottle-neck for data transmission within the entire datacenter.
Xpeedic’s solution provides a quick way to build full coverage of channels with accurate via model, transmission line and S-parameter.
Xpeedic’s solution can elevate entire channel performance, and report return loss, insertion loss, TDR, eye-diagram, ICN, ICR, ILD and more.
Xpeedic’s solution can import board and package layout file and check signal’s SI performance (Frequency domain and Time domain).
Xpeedic’s solution can help designer to build connector footprint and cable assemblies model and run characteristics analysis.
High-Speed Design for Datacenter/Server
With data channels required to perform at higher data rates, 56 Gbps or even 112 Gbps, crosstalk, to control insertion loss, return loss and other issues that affecting channel performance become a great challenge.
Xpeedic’s innovative solutions are making it possible for designers to meet the aggressive demands for higher data speeds in datacenter.
Build Channel Model
Channel performance is known as the bottle-neck for data transmission within the entire datacenter, and requires a fast and complete channels modeling method.
Channel Performance Analysis
Efficient solutions that elevate performance for the entire channel is critical.
Scattering (S) parameters, Eye diagrams, BER analysis, COM, ICN, ICR, pin map assignment optimization.
Data Channel’s IL Scan and Crosstalk Scan
Xpeedic’s solution offers a quick way to build full coverage of channels with accurate models for via, transmission line and S-parameter.
High-Speed Cable Modeling and Simulation
To address the data demand, a lot of copper cable assemblies are needed as a high-speed, cost-effective alternative to fiber optics for Ethernet, Fiber Channel, and InfiniBand technology applications, which requires a faster and accurater cable modeling method.
Via/Transmission Line Modeling and Simulation
ViaExpert/Hermes provides a quick way to build board and package model, supports parameter definition in many places, and deploys two solver technologies: one is the fast 3D full-wave finite element method solver, and another is the hybrid solver.
Scattering (S) parameters Analysis
SnpExpert is a popular tool for signal integrity measurements and data post processing of high-speed interconnects, such as cables, backplanes, PCBs and connectors.
Batch S-parameter post-processing to do de-embedding, TDR/Eye-diagram generation, mixed-mode (differential) conversion, combine, cascading, compliance check, one-click report and more.