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Xpeedic to Exhibit at WSCE2020

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Date: July 20-24, 2020

Place: Nanjing, China

Booth: X12

Xpeedic Technology will showcase its latest solutions at the2020 World Semiconductor Conference 2020 (WSCE) on August 26-28.

On the basis of the 2019 world semiconductor conference, the conference will further focus on the new trends, new trends and new products of the industry, provide international cooperation and exchange platform, and promote the rapid development of the semiconductor industry.

Xpeedic 5G solution enables designers inSoC, RFIC, packaging, board to build better 5G systems with theirdifferentiating technologies. It includes the following highlights:

dac2020-1

IC Category

On-chip passive modeling and simulation for RF and high performance analog designs for mobile, connectivity and optical applications
  • RFIC Passive Simulation
  • Analog/Mix Signal IC Passive Simulation
  • RF PDK Turn Key Solution

Package Category

Package modeling and simulation ranging from low cost packages to high performance interposer with TSV for mobile, networking and server applications

  • RFFE Module Simulation
  • Advanced Package Simulation
  • System in Package Simulation

System Category

Package and board level Signal Integrity analysis for high speed digital system designs in servers, storage and networking

  • RF PCB System Simulation
  • High Speed Digital System Simulation

wsce2020-1

More details to see here.