Entries by shen, yuqing

CDNLive Silicon Valley 2019

Date: April 2-3, 2019 Location: Santa Clara Convention Center – Santa Clara, CA CDNLive Silicon Valley brings together Cadence® technology users, developers, and industry experts for networking, sharing best practices on critical design and verification issues, and discovering new techniques for designing advanced silicon, SoCs, and systems that transform the way people live, work, and […]

Xpeedic to Exhibit at DAC2019

Date: June 2-6, 2019 Place: Las Vegas, NV, US Booth#:622 The Design Automation Conference (DAC) is the premier conference devoted to the design and automation of electronic systems (EDA), embedded systems and software (ESS), and intellectual property (IP). As a global leading provider of EDA software and Integrated Passive Device (IPD), Xpeedic will showcase its […]

Xpeedic to Exhibit at IMS2019

Date: June 2-7, 2019 Place: Boston, US Booth#: 210 Xpeedic Technology will showcase its latest solutions at the 2019 IEEE MTT-S International Microwave Symposium (IMS) in Boston Convention & Exhibition Center, June 2-7. Featured as in-booth demos will include Combined IRIS-HFSS Flow for Passive Modeling and Verification in Advanced Process Nodes. This flow is seamlessly […]

IPC PCB Design Forum

Date: March 20, 2019 Location: Booth 3300, Hall C3, Shanghai New International Expo Center Xpeedic will present at IPC PCB Design Forum with the topic titled < Automated Crosstalk Scan, Impedance Scan and DRC+ for Signal Integrity Signoff >. Please click here to find the detail agenda and register.

Automated Crosstalk Scan, Impedance Scan and DRC+ for Signal Integrity Signoff

Crosstalk analysis for high speed PCB design becomes more and more important due to the high data rate and tightly coupled routing. Traditional circuit-based analysis can not meet the accuracy demand. Three-dimensional (3D) full-wave electromagnetic solver is required to capture the complex 3D PCB environment and the frequency-dependent phenomena. This paper introduces a novel hybrid […]

Accurate Dk/Df Extraction for High-speed SI Applications

This application note presents an accurate way to perform dielectric constant (Dk) and dielectric loss (Df) extraction over a wide range of laminate materials for high-speed SI applications. The Through-Only De-embedding (TOD) method with optimization is used for this Dk/Df extraction. The resultant frequency dependent material models is ready to be used in electromagnetic simulation […]