未标题-1

Xpeedic to Exhibit at ICCAD 2017

Date: Nov.16-17, 2017
Location: Beijing, China
Booth#: 148-149

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2017 Annual Conference & Beijing IC Industry Innovation and Development Summit (ICCAD 2017) in Beijing on Nov.16-17, 2017.

ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain to exchange their expertise and to build up networks. This year, the theme is “Driven by Innovations, Lead the Development”. In this annual general meeting, the Integrated Circuit industry, especially the opportunities and challenges faced by the IC Design industry, will be discussed in details in order to enhance innovation capability and improve the comprehensive capability of Chinese Integrated Circuit industrial chain, thereby satisfying the market demands and boosting international competence.

At booth 148-149 ,Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

Dr. Wenliang Dai, co-founder, VP Engineering, will also present the leading design method “2.5D/3D Advanced Packaging Design for Artificial Intelligence Era” within IP and IC design forum on Nov.17.

For more details, please go to the conference official website:  http://www.cicmag.com/bbx/532285-532285.html

sip con

SiP Conference China

Date: Oct 19-20, 2017(Thur.-Fri.)
Place: HILTON SHENZHEN SHEKOU NANHAI, Shenzhen, China

SiP Conferences China 2017 is the first System-in-Package (SiP) conference in China fully dedicated to covering all aspects related to SiPs business and technology to meet current and future SiP challenges. The conference features inspiring sparkers from entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together to one place in Shenzhen, China.

The SiP Conferences China 2017 is the premier international event that brings the best in packaging, SiP manufacturing assembly and test, advanced SiP architectures and design mythologies, new materials solution to enhance SiP electrical, thermal and mechanical integrities.

Dr.Feng Ling, CEO of Xpeedic Technology will lead the ‘SiP Design and System Integration’session during the conference. Xpeedic team will also demonstrate its latest SiP, IPD and related EDA solutions and products then.

We look forward to meeting you there.

Detail agenda:


For more details, please click here.

台湾workshop

EDA Workshop

尊敬的工程師夥伴,
隨著芯禾科技EDA工具的使用者愈來愈廣,我們很榮幸的向大家推出《芯禾科技EDA Workshop》系列活動,以幫助大家更直接的掌握我們軟件的應用技巧和實戰攻略。
本期課程將以高速訊號設計者的角度,和大家一起探討25Gbps的高速系統設計挑戰和方法。随着乙太網路速率的不斷的提升,在高速系统中將會面臨到哪些關鍵因素的模擬和評估,怎樣優化高速設計中的過孔,焊盤,AC耦合電容,如何整體評估在時域或頻域上的通道品質,這些獨門絕技,我們傾囊相授。
課程將由芯禾科技資深技術支援Frankie及黃智宇講師領銜主講,歡迎有興趣的工程師報名參加。機會難得,歡迎大家報名和專家面對面交流!

培訓安排

  • 時間:2017年10月18日
  • 地點:臺北市忠孝東路三段1號 (億光大樓2樓/北科會議中心)

课程安排

  • 9:00~9:30 簽到
  • 9:30~9:45 培訓概覽
  • 9:45~10:45 系統設計中關鍵因素的模擬和評估
  • 11:00~12:00高速設計中過孔,焊盤,AC耦合電容的優化方法
  • 12:00~13:30 午餐
  • 13:30~14:30 高速設計中線纜及玻纖效應的建模分析
  • 14:45~15:30 通道品質在時域及頻域上的評估
  • 15:30~16:00 軟體現場演示

發送“姓名+公司名稱+職位+手機號碼”至郵箱marketing@xpeedic.com,馬上報名!

EPEPS 2017

EPEPS 2017

Date: Oct 15-18, 2017.
Location: San Jose, CA, US

EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.

Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

More details to see http://www.epeps.org/

QQ图片20170726092220

2017smic

SMIC 2017 Technology Symposium(Shanghai/Beijing)

Time & Location

  • Wednesday, Sept 13, 2017 in Shanghai
  • Thursday, Oct 12,2017 in Beijing

Xpeedic Technology will be exhibiting at the SMIC 2017 Technology Symposium Shanghai and Beijing on Sept. 13 and Oct. 12, 2017.

Xpeedic Technology will demonstrate its latest development EDA solution and IP solution as one of the valuable partners then. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

SMIC Symposium_1 SMIC Symposium_2

北京培训会

Training Program

尊敬的工程师伙伴,

随着芯禾科技EDA工具的使用群体越来越广,我们很高兴的向大家推出《芯禾科技EDA培训系列课程》,以帮助大家更直接的掌握我们软件的应用技巧和实战攻略。本期课程将围绕高速数字设计,和大家一起探讨“5G时代下的高速系统设计挑战和方法”。随着无线技术的不断升级,高速系统中面临哪些关键因素的仿真和评估,怎样优化高速设计中的过孔、焊盘、AC耦合电容,怎样实现多板级联下数据通道的全覆盖评估,这些独门绝技,我们倾囊相授。
课程将由芯禾科技资深技术支持赵晨星、王锐和刘岩讲师领衔主讲。
本课程对购买了芯禾科技EDA工具的客户免费开放(每个License限报名两人),也欢迎其他有兴趣的工程师报名参加。
机会难得,欢迎大家报名和专家面对面交流!

苏州芯禾电子科技有限公司

************************************************************************************************************************************

时间:2017年8月31日 周四 9:00-15:30
地点:北京红杉假日酒店 红桐厅 海淀区中关村双清路 89 号 A 座
培训费用:人民币1,000元,包括午餐、茶歇、配套软件及讲义等费用
报名优惠:前十名报名成功的工程师,减免所有培训费用
培训联系人:Max Cang (wei.cang@xpeedic.com)
课程安排:

9:00~9:30 签到
9:30~9:45 培训概览
9:45~10:45 系统设计中关键因素的仿真和评估
11:00~12:00 高速设计中过孔,焊盘,AC耦合电容的优化方法介绍
12:00~13:30 午餐
13:30~14:30 多板级联下数据通道的全覆盖评估
14:30~15:30 现场演示

点击这里,在线报名!

DAC54th

Xpeedic to Exhibit at DAC2017

Date:June 18-22, 2017
Place:Austin, US
Booth#:1923

The Design Automation Conference (DAC) is the premier conference devoted to the design and automation of electronic systems (EDA), embedded systems and software (ESS), and intellectual property (IP).

Xpeedic will showcase its EDA solution and IP solution in this event at Booth #1923. As a global leading provider of EDA software and Integrated Passive Device (IPD), Xpeedic’s analog / mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

More details to see https://dac.com/