designcon2018

Xpeedic SI Live Demo at DesignCon

Hi All,

We are very glad to announce Xpeedic's high-speed signal integrity live demo series at DesignCon 2018.

The demos will focus on six hottest topics. Several industry experts will present the demos and accommodate interactive discussions. There will also be a lucky draw at the end of each demo session.

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Topics – High-Speed Signal Integrity Live Demo

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MEET US AT

DesignCon2018   |    Booth 1034

Select topics and book your seat!

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DesignCon 2018

Please Join Us in Santa Clara for DesignCon 2018

This is your exclusive invitation to attend the largest meeting of chip, board, and systems design engineers with a complimentary Expo Pass or a 20% discount on Conference Packages! Now in its 23rd year, DesignCon offers high-caliber content, rich technical education, and in-depth training – all created by engineers for engineers.

This special discount comes to you courtesy of:

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Visit us at Booth #1034 

Register now and save 20% on your choice of an All-Access or 2-Day Pass by using this promo code EXD-EprTiC17 — or claim your complimentary Expo Pass. Start the new year ahead of the rest.

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DesignCon 2016

DesignCon 2016

Date: Jan. 19-22, 2016.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2016 at Santa Clara on Jan. 19-22, 2016.

DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.

Xpeedic will showcase its latest technology in high speed signal integrity (SI) solution, which can provide a fast and accurate way to enable engineers to simulate the high speed channel for both pre-layout and post-layout scenarios with great confidence, shorten the design cycle, and thus reduce the time to market.

At the same time, you can also find Xpeedic’s IP on silicon integrated passive devices (IPD) , which delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Visit Xpeedic at Booth #323 to find out more.

Website: http://www.designcon.com/santaclara/

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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

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Xpeedic to Exhibit at DesignCon 2014

Xpeedic Technology, Inc. will exhibit at DesignCon 2014 at Santa Clara on Jan. 28-31, 2014. Xpeedic will showcase their EDA software and System-in-Package (SiP) design service in the conference.

Xpeedic will bring fast and accurate signal integrity software for IC-package-system designs. ViaExpert enables fast via modeling and simulation for both pre-layout and post-layout scenarios. SnpExpert provides quick way to view S-parameter and the associated TDR. Hermes tool provides signal and power integrity simulation for complex IC-package-board designs including thru-silicon-via (TSV).

Xpeedic’s SiP design service enables customers to achieve system miniaturization by integrating ICs from different process into one package. Their IP on silicon integrated passive devices (IPD) empowers further miniaturization by integrating the peripheral passives for a broad range of RF applications.

Please visit Xpeedic at Booth #755 to find out more.