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Xpeedic to Exhibit at ICCAD 2017

Date: Nov.16-17, 2017
Location: Beijing, China
Booth#: 148-149

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2017 Annual Conference & Beijing IC Industry Innovation and Development Summit (ICCAD 2017) in Beijing on Nov.16-17, 2017.

ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain to exchange their expertise and to build up networks. This year, the theme is “Driven by Innovations, Lead the Development”. In this annual general meeting, the Integrated Circuit industry, especially the opportunities and challenges faced by the IC Design industry, will be discussed in details in order to enhance innovation capability and improve the comprehensive capability of Chinese Integrated Circuit industrial chain, thereby satisfying the market demands and boosting international competence.

At booth 148-149 ,Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

Dr. Wenliang Dai, co-founder, VP Engineering, will also present the leading design method “2.5D/3D Advanced Packaging Design for Artificial Intelligence Era” within IP and IC design forum on Nov.17.

For more details, please go to the conference official website:  http://www.cicmag.com/bbx/532285-532285.html

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Xpeedic to Exhibit at ICCAD 2016

Date: Oct.12-13, 2016
Location: Changsha, China
Booth#: 29-30

Xpeedic Technology Co. Ltd, will exhibit at CSIA-ICCAD 2016 Annual Conference in Changsha on Oct.12-13, 2016.

ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain to exchange their expertise and to build up networks. This year, the theme is “Chip Silicon Valley in Xiangjiang River, realize your dream”.

At booth 29-30,Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

Dr. Wenliang Dai, co-founder, VP Engineering, will also present the leading design method “Faster, accurate, user-friendly – An advanced RF IC EDA and IP solution from China” within EDA forum on Oct.13.

For more details , please go to the conference official website: http://www.cicmag.com/bbx/532285-532285.html

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Xpeedic to Exhibit at ICCAD 2015

Date: Dec.10-11, 2015
Location: Tianjin, China

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2015 Annual Conference in Tianjin on Dec.10-11, 2015.
ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain to exchange their expertise and to build up networks. This year, the theme is “Collaborative Innovation, Quality and Efficiency Improvement, IC Dream Achievement”.

At booth A18-19,Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

Dr. Wenliang Dai, co-founder, VP Engineering, will also present the leading design method “Chip Level Integrated Passive System Design-IPD” within IP and IC design forum on Dec.11.
For more details , please go to the conference official  website: http://www.csia-iccad.net.cn/

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ICCAD 2014

Date:Dec. 11-12, 2014.

Location: Hong Kong

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2014 Annual Conference at Hong Kong on Dec. 11-12, 2014.
At Dec 12, Dr.Wenliang Dai, Engineering VP, will present the leading design method-“RFSiP Miniaturization by Integrated Passive Devices(IPD)” with IC industry companion in ICCAD Subject Forum 3.
At booth 1F#21-22,Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

The conference official  website:
http://www.csia-iccad.net.cn/
http://www.cicmag.com/bbx/856303-856303.html

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Xpeedic to Exhibit at CSIA-ICCAD 2013

Xpeedic Technology, Inc. will exhibit at ICCAD 2013 in Hefei, Anhui Province, China on Oct 10-11, 2013. Xpeedic will show their EDA software and IPD IP in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS and iModeler, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designs. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Please visit Xpeedic at Booth #25-26 to find out more.

Dr. Wenliang Dai, VP of Engineering of Xpeedic, will present the following paper in Subject Forum (II).

Paper: 3D IC Integration with TSV EDA, IPD Chip, and SiP Technology
Presenter: Wenliang Dai, PhD
When: 13:00-13:25, Friday, Oct. 11, 2013
Where: Floor 3, Room 2, Anhui Int’l Convention and Exhibition Center

More detail…

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Xpeedic to Exhibit at CSIA-ICCAD 2012 Annual Conference & Chongqing IC Leapfrog Development Summit Forum

The 18th ICCAD 2012 will be held in Chongqing, China on December 6-7, 2012. The theme of this year is Development and Innovation, Executing Advantages, Optimization of Industrial Structure, and Creating a Leading Electronic Information Industry.

Dr. Wenliang Dai will have a technical presentation “Xpeedic RFIC and 3DIC Design & Simulation Platform” in IP and IC Design Session at 17:00-17:30 on Dec 7, Friday, 2012.

Please visit Xpeedic in booth B01-02 at the second floor at Chongqing International Conference & Exhibition Center on December 6-7, 2012. More detail…