IMS2018-1

Xpeedic to Exhibit at IMS2018

Xpeedic Technology will showcase its latest solutions at the 2018 IEEE MTT-S International Microwave Symposium (IMS) in Philadelphia, June 12-14.

Featured as in-booth demos will include

  • Combined IRIS-HFSS Flow for Passive Modeling and Verification in Advanced Process Nodes.
    This flow is seamlessly integrated in Cadence Virtuoso platform, and gives IC designers not only the fast and accurate passive modeling and synthesis capability at the design stage with Xpeedic accelerated Method of Moments (MoM) solver engine and artificial neural network(ANN) technique , but also the verification capability enabled by HFSS at the sign-off stage.
  • Integrating IRIS Plus in Nuhertz FilterSolutions to Enable Fast Filter Simulation.
    It presents a fast filter design flow by taking advantage of both the filter synthesis from Nuhertz FilterSolutions and the 3D full-wave electromagnetic simulation from Xpeedic IRIS Plus. Designers can use this combined single flow for fast filter prototyping without manually transferring CAD data from layout to EM simulation, thus improving the design efficiency.
  • Through Glass Via (TGV) Based Integrated Passive Device Technology for RF Front End Design
    Through Glass Via technology has become a promising technology candidate to realize integrated, low cost and high performance passive devices. Xpeedic will introduce passive device (such as filters and diplexers) technology built with TGV, which can have less in-band insertion loss and greater out-of-band rejection yet still compact size.

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For more information, visit Xpeedic at Booth 1705 at the show.

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EDI CON 2018

Xpeedic to Exhibit at EDI CON China 2018

Date: Mar 20-22, 2018.
Location: Beijing, China
Booth: 603

EDI CON is an opportunity for design engineers and system integrators to learn about the latest RF/microwave and high speed digital products and technologies for today's communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. With a focus on applications, emerging technologies and practical engineering solutions, this annual event brings together the designers at the forefront of Chinese innovation and the world's leading multi-national technology companies. EDI CON includes keynotes presentations from industry executives and government officials, technical presentations, workshops, expert panels, exhibitor showcase and networking reception. The three day event will be held March 20-22, 2018 at the China National Convention Center in Beijing, China.

Xpeedic will showcase its high speed signal integrity solution and integrated RFIC solution, including EDA software, IPD (Integrated passive devices) and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

More details to see http://www.ediconchina.com/default.asp

sip con

SiP Conference China

Date: Oct 19-20, 2017(Thur.-Fri.)
Place: HILTON SHENZHEN SHEKOU NANHAI, Shenzhen, China

SiP Conferences China 2017 is the first System-in-Package (SiP) conference in China fully dedicated to covering all aspects related to SiPs business and technology to meet current and future SiP challenges. The conference features inspiring sparkers from entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together to one place in Shenzhen, China.

The SiP Conferences China 2017 is the premier international event that brings the best in packaging, SiP manufacturing assembly and test, advanced SiP architectures and design mythologies, new materials solution to enhance SiP electrical, thermal and mechanical integrities.

Dr.Feng Ling, CEO of Xpeedic Technology will lead the ‘SiP Design and System Integration’session during the conference. Xpeedic team will also demonstrate its latest SiP, IPD and related EDA solutions and products then.

We look forward to meeting you there.

Detail agenda:


For more details, please click here.

EPEPS 2017

EPEPS 2017

Date: Oct 15-18, 2017.
Location: San Jose, CA, US

EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.

Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

More details to see http://www.epeps.org/

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DAC54th

Xpeedic to Exhibit at DAC2017

Date:June 18-22, 2017
Place:Austin, US
Booth#:1923

The Design Automation Conference (DAC) is the premier conference devoted to the design and automation of electronic systems (EDA), embedded systems and software (ESS), and intellectual property (IP).

Xpeedic will showcase its EDA solution and IP solution in this event at Booth #1923. As a global leading provider of EDA software and Integrated Passive Device (IPD), Xpeedic’s analog / mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

More details to see https://dac.com/

IMS2017

Xpeedic to Exhibit at IMS2017

Date:June 4-9, 2017
Place:Honolulu, US
Booth#:414

The annual IMS Exhibition is held in conjunction with the IEEE MTT International Microwave Symposium (IMS), RFIC, and ARFTG Technical Symposia and offers an excellent opportunity for all segments of the microwave community to meet. IMS2017 offers technical sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, application seminars, historical exhibits, and a wide variety of other technical and social activities including a guest program. Whatever you are looking to acquire, you will find the industry leaders ready and willing to answer your purchasing and technical questions.

Xpeedic will showcase its EDA solution and IP solution in this event at Booth #414. As a global leading provider of EDA software and Integrated Passive Device (IPD), Xpeedic’s analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

For more details, please visit www.ims2017.org

EDICON2017

Xpeedic to Exhibit at EDI CON China 2017

Date: Apr 25-27, 2017.
Location: Shanghai, China
Booth: 360

EDI CON is an opportunity for design engineers and system integrators to learn about the latest RF/microwave and high speed digital products and technologies for today's communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. With a focus on applications, emerging technologies and practical engineering solutions, this annual event brings together the designers at the forefront of Chinese innovation and the world's leading multi-national technology companies. EDI CON includes keynotes presentations from industry executives and government officials, technical presentations, workshops, expert panels, exhibitor showcase and networking reception. The three day event will be held April 25-27, 2017 at the Shanghai Convention & Exhibition Center of International Sourcing in Shanghai, China.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

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More details to see http://www.ediconchina.com/default.asp

IC设计论坛

Tech Shanghai 2017

日期:2017年3月23日

地点:上海,长荣桂冠酒店

在竞争日趋激烈的IC设计行业,任何一次技术升级都将引起行业洗牌,而作为企业中流砥柱的工程师,提高自身设计能力是永恒的话题。

本论坛邀请了海内外领先EDA、IP、测试等厂商(Xpeedic芯禾科技、Altium、Cadence、Keysight、Kilopass、芯愿景等)的技术专家出席,关注IC设计的您怎能错过?

1. 演讲议程

IC

*主办单位保留修改议程之权利,会议议程以本次活动现场为准。

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2. 现场大奖

有机会赢取Ipad min2 、Apple Watch Series 1 各一台!

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3. 业界大厂出席

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4. 报名

点击“http://survey.eet-china.com/669433”即可抢先报名,组团参会领队更有精美礼品!

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EPEPS 2016

Date: Oct 23-26, 2016.
Location: San Diego, CA, US
EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.
Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.
More details to see http://www.epeps.org/