2017smic

SMIC 2017 Technology Symposium(Shanghai/Beijing)

Time & Location

  • Wednesday, Sept 13, 2017 in Shanghai
  • Thursday, Oct 12,2017 in Beijing

Xpeedic Technology will be exhibiting at the SMIC 2017 Technology Symposium Shanghai and Beijing on Sept. 13 and Oct. 12, 2017.

Xpeedic Technology will demonstrate its latest development EDA solution and IP solution as one of the valuable partners then. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

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SMIC Advanced Technology Workshops

Time & Location

  • Thursday, April 13, 2017 in Shanghai
  • Tuesday, April 18,2017 in Santa Clara

The 2017 SMIC Advanced Technology Workshops will be organized in Shanghai, and Santa Clara, CA during the months of April 2017.

Xpeedic Technology will demonstrate its latest development EDA solution and IP solution as one of the valuable partners then. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

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Asian IBIS Summit (Shanghai/ Taipei)

Data: Friday, Nov.11, 2016 in Shanghai/ Monday, Nov.14,2016 in Taipei
Location: Parkyard Hotel Shanghai, 699 Bibo Road, Zhangjiang Hi-Tech Park, Shanghai/ The Sherwood Hotel, No.111, Sec.3, Min Sheng East Road, Taipei

Xpeedic Technology will participate the Asian IBIS Summit Shanghai and Taipei on Nov. 11 and Nov.14, 2016. Dr. Wenliang Dai, VP of Engineering and Zachary Su, AE manager of Xpeedic Technology will deliver the following speech:

Paper: Multiple Channel Analysis for Orthogonal Backplane Design
Authors: Dr. Wenliang Dai and Zachary Su

More details to see: http://www.eda.org/ibis/summits/

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Signal integrity in high speed digital design Seminar

Signal integrity in high speed digital design Seminar will be jointly organized by Xpeedic Technology, Taiwan Electronic Connection Industry Association and Polar Instruments on Nov.3, 2016.

This seminar will introduce the main challenges of signal integrity in high speed design and the practical solutions. CEO of Xpeedic and his team will deliver a comprehensive presentation and SI experts from Lenovo, Keystone and Advantech will also share their success cases then.

Please join us by registration in Taiwan@polarinstruments.asia.

  • Time:Thursday 2016/11/3 9:00-16:30
  • Place:Novotel Taipei Taoyuan International Airport
  • Agenda

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SMIC 2016 Technology Symposium in Shanghai

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Date: Sept. 1, 2016.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2016 Technology Symposium in Shanghai on Sept, 1, 2016.

As SMIC dedicated IPD IP vendor, Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service.

Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

Please come to our booth for further discussion if you have any interest.

For more details, please visit http://service.smics.com/symposium/website/CN/en/index.jsp

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Xpeedic to Exhibit at Tech Shanghai 2016

Date: Mar 14-16, 2016.
Location: Shanghai, China
Booth: E06

In 2016, UBM and IEEE join forces to launch Tech Shanghai, where engineers will find the latest developments in the electronics industry, from highly automated driving, Industry 4.0 to the Internet of Things. Tech Shanghai combines UBM’s 20 years of experience in organizing China’s foremost technical events for electronic engineers and IEEE’s expertise in hosting the world’s largest and most respected microwave symposium since 1957.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

More details to see http://www.techshanghaievent.com/index

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Xpeedic Taiwan 2015 EDA Seminar is coming

Xpeedic Technology, Inc. will host an EDA seminar in Taipei, Taiwan on Oct.12, 2015.

High speed communication link design becomes more and more challenging because of the ever increasing data rate and the rapid development of semiconductor and IC technology. At multi-gigabit per second data rate, designers must characterize all the pieces in the signal path from transmit to receiver to address the signal integrity issues, including reflections, crosstalk, Simultaneous Switching Noise (SSN) and so on. Even a small discontinuity can significantly degrade the signal.

This seminar is targeting the SI engineers and to discuss fast and accurate way to model and simulate discontinuities along the path and optimize the channel performance. Xpeedic’s co-founder CEO Dr.Ling and VP engineering Dr. Dai will present within the seminar.

Detail agenda:

9:30-9:40 Welcome and Overview
9:40-10:10 S-parameter in high speed SI
10:10-10:40 Via modeling and optimization
10:40-11:00 Coffee/tea break
11:00-11:30 Impedance discontinuities from surface mounted pads
11:30-12:00 High speed channel modeling and optimization
12:00-13:00 Luck draw and Lunch

Venue: Conference center of National Taipei University of Technology
Contact: 02-2741-7655#201~202

If you have interest, please send email to Marketing@xpeedic.com for registration.

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Asian IBIS Summit (Shanghai)

Data:  Friday, Nov. 14, 2014.
Location:  Parkyard Hotel Shanghai, 699 Bibo Road, Zhangjiang Hi-Tech Park, Shanghai 201203, P.R. China

Xpeedic Technology, Inc. will participate the Asian IBIS Summit (Shanghai) on Nov. 14, 2014. Dr. Wenliang Dai, VP of Engineering of Xpeedic Technology, Inc.,  will deliver the following speech.
Paper:     Connector Via Footprint Optimization for 25Gbps Channel Design
Authors:  Wenliang Dai and Zhouxiang Su
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SMIC 2014 Technology Symposium in Shanghai

Date: Sept. 18, 2014.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.