Xpeedic to Present at the 6th Shanghai FD-SOI Forum and 2018 RF-SOI Workshop

  • Date: September 18-19, 2018
  • Place: Shanghai, China

The 6th Shanghai FD-SOI Forum & 2018 International RF-SOI Workshop will be held in Shanghai at September 18-19, 2018.

The 6th Shanghai FD-SOI Forum

The 6th Shanghai FD-SOI Forum will be focused on FD-SOI applications, products, in particular AIoT and automotive electronics. There are keynote speeches by executives from Samsung and GLOBALFOUNDRIES. The theme of this year’s Forum is Deployment of FD-SOI, for which there are two sessions: AIoT using FD-SOI and automotive electronics using FD-SOI.

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2018 International RF-SOI Workshop

The workshop will be focused on 5G connectivity and opportunity for RF-SOI industry. Keynotes speaker includes 5G carrier, system provider and device maker. They will provide insight on 5G deployment and RF-SOI readiness. The session “China RF-SOI ecosystem” will have speakers from Chinese fabless companies and foundries to talk about their progress on RF-SOI, and session “RF-SOI supply chain” will be focused on worldwide RF-SOI supply chain.

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Xpeedic has been participated the events as an active SOI Industry Consortium member. Xpeedic's passive modeling and simulation tool, IRIS, has been certified on FD-SOI process nodes including 22FDX from GlobalFoundries and 28FDS from Samsung Foundry. Xpeedic's IPD/SiP solution helps RF Front End (RFFE) design customers, where RF-SOI is the main technology player, to achieve high integration and system miniaturization.

In 2018 International RF-SOI Workshop, Dr. Feng Ling, CEO of Xpeedic Technology, will give a presentation titled “RF-SOI for RFFE Solution: An EDA Perspective” in the China RF-SOI Ecosystem session to showcase Xpeedic's contribution.


Xpeedic to Exhibit at GLOBALFOUNDRIES GTC2018

Date: September 25, 2018

Place: Santa Clara, CA

As a valuable GLOBALFOUNDRIES EDA partner, Xpeedic Technology will showcase its latest solutions at GTC2018 (GLOBALFOUNDRIES Technology Conference) in Santa Clara, September 25, 2018.

Featured as in-booth demos will include


  • Combined IRIS-HFSS Flow for EM simulation in GLOBALFOUNDRIES Process Nodes

This flow is seamlessly integrated in Cadence Virtuoso platform, and gives IC designers not only the fast and accurate passive modeling and synthesis capability at the design stage with Xpeedic accelerated Method of Moments (MoM) solver engine and artificial neural network(ANN) technique , but also the verification capability enabled by HFSS at the sign-off stage.

  • Integrated Passived Device Technology for RF Front End Design

IPD is a core technology for implementing highly integrated RF front-end modules. Utilizing high-resistance silicon and thick copper processes, IPD has both consistency and high integration of semiconductor process, and good RF performance similar to traditional thick film processes such as LTCC. With its unique IPD design methodology and process, Xpeedic has developed a series of filters, duplexers, couplers, power dividers and other devices, which are widely used in antenna switch modules, power amplifier modules and other RF front-end modules.

  • IPD-enabled System-in-Package for Integrated System

SiP technology can integrate multiple chips of different processes (CMOS, SOI, GaAs, etc.) and different functions (digital, analog, RF, etc.) into one package, achieving the advantages of miniaturization, high performance and low cost. Xpeedic can also integrate its unique IPD into SiP and achieve even higher integration. Thanks to its proprietary EDA tools, dedicated IPD/SiP design teams, wafer and packaging partners, the company is able to provide customers with one-stop SiP solutions and services.

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