Xpeedic to Present Two Papers at IEEE EMC+SIPI 2018

Date: 7/30-8/3, 2018

Location: Long Beach, CA, US

Xpeedic will participate in the 2018 IEEE Symposium on Electromagnetic Compatibility and Signal, Power Integrity (EMC+SIPI) held at Long Beach Convention Center in California, USA on July 30-Aug 3, 2018.

Xpeedic has two papers accepted after a rigorous peer review process and will present them at the following time slots:

Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

  • Time: 7/31 4:00PM
  • Author: Feng Ling (Xpeedic Technology); Kevin Cai (Cisco Systems, US); Bidyut Sen (Cisco Systems, US)

An Empirical Model for Foamed High-Speed Cable

  • Time: 8/2 4:00PM
  • Author: Xin Wu (Wandtec (Shenzhen) Optronics Technology); Feng Ling (Xpeedic Technology)

We look forward to meeting you there.

For more details, please click here.


Xpeedic to Exhibit at DAC2018

Date: June 25-27, 2018

Place: San Francisco, CA, US

Booth#: 2041

The Design Automation Conference (DAC) is the premier conference devoted to the design and automation of electronic systems (EDA), embedded systems and software (ESS), and intellectual property (IP).

As a global leading provider of EDA software and Integrated Passive Device (IPD), Xpeedic will showcase its EDA and IP solution and several fascinating demos, including IRIS for passive modeling and simulation in advanced nodes, IRIS for both high-resistivity silicon (HRSi) and through-glass-via (TGV) based IPD design, Hermes for 3D package simulation, and expert-series signal integrity tools for high speed systems.


Xpeedic is also invited to participate at Samsung Foundry's DAC 2018 Theater as a valuable SAFE partner. Xpeedic CEO, Dr. Feng Ling will give the presentation titled “Accurate Passive Modeling and Simulation for Advanced Process Nodes” at Samsung's booth.


More details to see https://dac.com/