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Metis – Fast Package and IC Co-simulation

Background

As Moore's Law is gradually approaching the physical limit, the continuous product PPA benefits brought by upgrading process technology are increasingly challenged, which drives system designers to search for heterogeneous integration technologies. 3DIC and Chiplet are realized through heterogeneous integration, which provides additional opportunities for system level function integration and packaging cost optimization, and has been widely used in HPC, data center, high-end router and other fields. The success of HBM is a good application case of heterogeneous integration advantages. Through advanced packaging and integration technologies, HBM can achieve higher storage density and reduce the delay between computing and storage to meet the needs of high-performance computing. However, heterogeneous integration poses a higher technical challenge to designers: a large number of high-speed SerDes and Memory interconnect lines require a full-wave 3D electromagnetic simulation engine for rapid analysis, and can cover up to 60 GHz. The traditional RC extraction tools cannot meet the accuracy requirements, and mainstream electromagnetic simulation engine tools cannot solve cross-scale simulation problems from chip nanometer level to package centimeter level and heterogeneous integration ultra-large-scale problems. The Metis solution launched by Xpeedic for heterogeneous integration solves the above-mentioned problems well, and introduces a very simple and easy-to-use simulation analysis process to help designers accelerate design iterations.


Overview

Xpeedic Metis is an EDA platform for bare chip, 3DIC, Chiplet or advanced package co-simulation. It provides convenient integration with chip design tools and package design tools, allows users to skip the cumbersome configuration of traditional modeling tools, and quickly and accurately optimize the design by considering the whole physical environment of key areas; The three-dimensional full wave high-precision electromagnetic simulation engine mom solver embedded in Metis can cover the simulation frequency of DC THz, fully meet the application accuracy requirements of heterogeneous integration, such as medium, high-speed and high-frequency, and can perfectly support cross-scale simulation from nano to centimeter level; Metis integrated Xpeedic original core technologies such as Absorbing Fence, Magnetic Current and Mesh Tunneling, which can achieve the simulation requirements of ultra-large-scale heterogeneous packaging under the premise of ensuring accuracy.

2.5D Interposer with TSV

IC-Package Co-Simulation


Main Features

  • Support Die-Interposer-Package co-simulation, and embeds three typical simple simulation processes, including chip and package co-simulation, 3DIC co-simulation, advanced packaging and PCB co-simulation, so as to realize the integrated process of importing, stacking, automatic porting and starting simulation of various layout files.

  • Embedded with the industry-leading three-dimensional electromagnetic simulation engine mom solver, it covers the high-precision and fast simulation of DC THz, and supports cross-scale simulation from nanometer to centimeter.

  • With mesh tunneling mesh adaptive generation technology, the solution scale is greatly reduced and the simulation efficiency is improved on the premise of ensuring the accuracy of heterogeneous packaging.

  • Metis embeds XHPC and XCloud modules, manages all simulation projects through the built-in simulation task platform JobQueue, and maximizes the use of Metis two-level distributed acceleration technology. The first level is matrix-level distributed computing, which allocates MoM Solver matrix operations to computing clusters or cloud, and the second level is stand-alone parallel computing technology.

  • Three simulation modes of "accuracy", "balanced" and "speed" are embedded to help users quickly switch grid and mom solver settings according to simulation requirements, so as to improve software ease of use.

  • Support advanced layout repair functions, especially the corners and arc areas of routing, providing a more stable and friendly simulation structure for simulation.

  • Add the grid real-time display and correct check functions to ensure one-to-one correspondence between the actual version and grid division, reducing the risk of simulation errors.

  • Support one-click export to HFSS, and automatically create 3D models, Airbox, materials, stacks, excitations, simulation boundaries, and frequency settings.


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