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Product Datasheet

Product Datasheet

Hermes 3D: High Speed PCB Signal Integrity Analysis

Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming. 

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Hermes_DataSheet_EN_2020.01.pdf



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