Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity is the critical one which requires extra attention in channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity. Conventional 3D full-wave simulation approach suffers from various drawbacks including the complex model creation and the long simulation time. ViaExpert provides a fast and accurate way to simulate via structures for both pre-layout and post-layout scenarios.
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