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Product Datasheet

Product Datasheet

ViaExpert: 3D Via Modeling and Simulation

Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity is the critical one which requires extra attention in channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity. Conventional 3D full-wave simulation approach suffers from various drawbacks including the complex model creation and the long simulation time. ViaExpert provides a fast and accurate way to simulate via structures for both pre-layout and post-layout scenarios. 

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ViaExpert_DataSheet_EN_2020.01.pdf



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