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5G Mobile

Background

5G network represents the next milestone in mobile communications: targeting more traffic and capacity with less delay and power consumption through large-scale multiple-input multiple-output (MIMO) and beamforming antenna arrays, millimeter wave (mmWave) spectrum, and carrier aggregation (CA). These core technologies have greatly increased the number of channels of RF front-end chips in mobile terminals, and promoted a corresponding large-scale increase in the consumption of transceivers, filters, antenna tuning, switches and other devices.

At the same time, the integration of RF chips have to be further improved towards modularization, which will bring unprecedented challenges to the design and simulation of RF chips in the future. How to deal with complex electromagnetic coupling and how to perform IC package co-simulation are the aspects to be considered.


Xpeedic's Industry-leading 5G Mobile Solution

Xpeedic 5G Mobile Solution is mainly aimed at the electromagnetic simulation design and optimization challenges of baseband chips, RF chips, and RF front-end chips such as filters/LNA/PA within 5G mobile phones. What’s more, the matching design of multiple modules in the system and high-speed circuit simulation and optimization are also facing the challenge of complex electromagnetic analysis. The solution includes full coverage of simulation from chip, package to system, and satisfies simulation in Sub-6GHz and millimeter wave bands.


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IRIS for on-chip passive modeling

Metis for package extraction  

Metis for IC/package co-simulation

Hermes for package /PCB simulation

XDS for RF Module/PCB simulation

A suite of tools for High-speed PCB SI simulation

Heracles for high-speed PCB automated SI sign-off



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