Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming.
HERMES SI is an application which use three-dimensional full-wave EM simulation to deal with high-speed serial circuit. It provides a fast and accurate import brd models, check the signal integrity metrics such as insertion loss, return loss, and crosstalk; it also allows designer to perform simulation and track processing for the post-layout model.
HERMES SI supports following main features:
Optimized mesh algorithm improves simulation speed and precision
Fast 3D FEM solver provides high-precision, high-quality solution
Hybrid solver provides high-speed solution, performance is higher than similar products in market
Support import brd model
Manually add port, analysis setting
The 3D view function makes the model checking more easily and visually
Support export result to HFSS and CTS
Built-in full wave FEM3D solver and Hybrid solver.
Automatic port generation simplifies EM analysis setup.
Seamlessly link to SnpExpert for S-parameter viewing and post-processing.
The FEM3D solver provides high-precision, high-quality simulation results. While the Hybrid solver focuses on simulation speed and provides a solution for rapid analysis
Optimization mesh improves the simulation accuracy and speed
Support PCB and package Co-simulation
Support to create and edit Bondwire, Solder ball
Support material library and padstack library management
Support the latest tabbed routing template for quick modeling
Support to import ODB++ , IPC-2581, Allegro brd\mcm\sip, PADS ASC file
3D-View makes the model check easier
Add a recent project management panel to achieve a quick preview of recent projects
Support to quickly edit trace and padstack
Support cutting a smaller rectangler or polygonal area by for analysis , reducing simulation scale
Support export models to third-party tools, such as HFSS or CST
What's New in Hermes 2020.01
Support import, display and edit Rigid-Flex PCB
Optimize algorithm to improve accuracy
Support import dummy net
Support component filtering
Support editing drilling material and copper roughness, export to HFSS
Support isolated copper removal option
Support editing air box
Support adding different solder balls to different pads of the chip
Support separate display of solder balls and dielectric of different layers
Support batch editing port
Support adding lump ports on solder balls
Support output S-parameter/Y-parameter/Z-parameter