High speed communication link design becomes more and more challenging because of the ever increasing data rate and the rapid development of semiconductor and IC technology. At multi-gigabit per second data rate, designers must characterize all the pieces in the signal path from transmit to receiver to address the signal integrity issues, including reflections, crosstalk,Simultaneous Switching Noise (SSN) and so on. Even a small discontinuity can significantly degrade the signal.Xpeedic's high speed SI solution provides a fast and accurate way to allow SI engineers to model and simulate the discontinuities along the path and then optimze the channel performance.

Xpeedic High Speed SI Solution

SnpExpert – S-parameter Exploration

ViaExpert – 3D Via Modeling and Simulation

ChannelExpert – High Speed Channel Exploration

CableExpert – Cable Modeling and Simulation

TmlExpert – TML Modeling and Simulation

HERMES SI – Package and Board level signal integrity analysis

JobQueue – Simulation Job Queue System

Heracles – Automated SI Signoff for High Speed Design

LibManager – Library Management Platform

Metis – Fast Package and IC Co-simulation