HERMES SI – Package and Board level signal integrity analysis


Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming.

Product Introduction

HERMES SI is an application which use three-dimensional full-wave EM simulation to deal with high-speed serial circuit. It provides a fast and accurate import brd models, check the signal integrity metrics such as insertion loss, return loss, and crosstalk; it also allows designer to perform simulation and track processing for the post-layout model.
HERMES SI supports following main features:

  • Optimized mesh algorithm improves simulation speed and precision
  • Fast 3D FEM solver provides high-precision, high-quality solution
  • Hybrid solver provides high-speed solution, performance is higher than similar products in market
  • Support import brd model
  • Manually add port, analysis setting
  • The 3D view function makes the model checking more easily and visually
  • Support export result to HFSS and CTS


Multiple Ways to Create Models

Hermes provides quick ways to create models:

  • Support import brd, mcm, sip file from Cadence
  • Support import ODB++ file
  • Effective cutting for the imported files, so that choose simulation area purposely to avoid simulation area tool big

3D Model

  • 3D view provides a more intuitive view of the model, the user can setup show/hide different modules, ports, plates, stacks, etc.

Import Multiple Models

  • In ODB++ flow, now support multiple models, user can set the second model’s height, location and rotate it.

Add Port

  • Support manually add Coax port for the Signal pin, add the Lump port or SMP port on the trace, select the port layer and set the port of some parameters, such as the port's inner and outer radius, height and characteristic impedance.

Add Bondwire

  • Add bondwire to connect pads or two models.

Edit Trace

  • Change the length and direction of trace by editing its center line.

FEM3D Solver

  • Considering the requirements of precision and performance, Hermes provides three kinds of solvers: FEM3D solver has more reliable accuracy and more high quality results, Hybrid solver in ensuring the premise of certain precision with faster speed, greatly improving the solving efficiency, Cascading solver has high simulation efficiency, using Tline2DSolver solver to obtain the S parameters of transmission line, which simplifies transmission line simulation model; above three kinds of solvers are a combination of parallel technology to improve running efficiency, at the same time, the distributed and multi core processing, compared to similar products on market have more competitive advantage.

Result Post-Process

S parameters generated by Hermes can be displayed through the SnpExpert. Users can view more features of the parameters and results:

  • Single ended and paired port conversion
  • Display S parameters, TDR and eye diagram
  • Include FEXT, NEXT, PSXT, ILD, ICN, ICR and other graphics display
  • Include comparison of standard parameters, such as 802.3ba OIF, CEI-25G/28G IEEE, etc
  • The calculation and display for passivity, causality, reciprocity, stability metrics, and enforcements

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