HERMES SI – Package and Board level signal integrity analysis
Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming.
HERMES SI is an application which use three-dimensional full-wave EM simulation to deal with high-speed serial circuit. It provides a fast and accurate import brd models, check the signal integrity metrics such as insertion loss, return loss, and crosstalk; it also allows designer to perform simulation and track processing for the post-layout model.
HERMES SI supports following main features:
Optimized mesh algorithm improves simulation speed and precision
Fast 3D FEM solver provides high-precision, high-quality solution
Hybrid solver provides high-speed solution, performance is higher than similar products in market
Support import brd model
Manually add port, analysis setting
The 3D view function makes the model checking more easily and visually
Support export result to HFSS and CTS
Multiple Ways to Create Models
Hermes provides quick ways to create models：
Support import brd, mcm, sip file from Cadence
Support import ODB++ file
Effective cutting for the imported files, so that choose simulation area purposely to avoid simulation area tool big
3D view provides a more intuitive view of the model, the user can setup show/hide different modules, ports, plates, stacks, etc.
Import Multiple Models
In ODB++ flow, now support multiple models, user can set the second model’s height, location and rotate it.
Support manually add Coax port for the Signal pin, add the Lump port or SMP port on the trace, select the port layer and set the port of some parameters, such as the port’s inner and outer radius, height and characteristic impedance.
Add bondwire to connect pads or two models.
Change the length and direction of trace by editing its center line.
Considering the requirements of precision and performance, Hermes provides three kinds of solvers: FEM3D solver has more reliable accuracy and more high quality results, Hybrid solver in ensuring the premise of certain precision with faster speed, greatly improving the solving efficiency, Cascading solver has high simulation efficiency, using Tline2DSolver solver to obtain the S parameters of transmission line, which simplifies transmission line simulation model; above three kinds of solvers are a combination of parallel technology to improve running efficiency, at the same time, the distributed and multi core processing, compared to similar products on market have more competitive advantage.
S parameters generated by Hermes can be displayed through the SnpExpert. Users can view more features of the parameters and results:
Single ended and paired port conversion
Display S parameters, TDR and eye diagram
Include FEXT, NEXT, PSXT, ILD, ICN, ICR and other graphics display
Include comparison of standard parameters, such as 802.3ba OIF, CEI-25G/28G IEEE, etc
The calculation and display for passivity, causality, reciprocity, stability metrics, and enforcements