ViaExpert – Via Modeling and Simulation

Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity is the critical one which requires extra attention in channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity. Conventional 3D full-wave simulation approach suffers from various drawbacks including the complex model creation and the long simulation time. ViaExpert provides a fast and accurate way to simulate via structures for both pre-layout and post-layout scenarios. The built-in connector footprint database allows users to quickly assemble the model with connector footprint, breakout region trace, and a given stackup.

ViaExpert supports many features below

  • Optimized mesh function improves simulation speed and precision.
  • Fast 3D FEM solver offers better fidelity and quality.
  • Fast Hybrid solver offers better capacity and speed compared to other tools in market.
  • Multiple ways to create models or import Allegro brd.
  • Auto port generation simplifies EM analysis setup.
  • Support parametric and optimization sweep simulation.
  • 3D-View makes the model check easier.
  • Export to HFSS and CTS.
  • SnpExpert displays S-parameter and TDR.
  • Support parametrized templates (Diff Via, SMA, SMD, SMP,CMF, Decap, BGA).
  • “Material Library” module to unify frequency dependent material define, modify, export and re-use flow across different projects, and even different teams.
  • Seamlessly link to SnpExpert for S-parameter viewing and post-processing.
Main Features
  • Optimization mesh improves the simulation accuracy and speed
  • Fast 3D FEM and hybrid solver offers better capacity and speed compared to other tools in market
  • Support HPC, remote and local simulation under the management of XDPM (Xpeedic Distributed Processing Management) module to maximize high computing machine availability
  • Built-in connector footprint library, easy to build connector via model
  • Multiple ways to create via models or import Cadence .brd, .mcm, .sip file
  • Support arbitrary via array define, move, duplicate, align top/bottom/left/right, distribute horizontally/vertically, undo and redo features in 2D footprint window
  • Easy to add via tear drop and trace compensation
  • Easy to modify stackup, trace length, trace width, pad size and antipad size
  • Support arbitrary parameterized keepout definition, management and usage in 2D footprint window to explore the optimal antipad geometry, the keepout shape can be defined by the unite of lines/arcs or regular parameterized geometries
  • Optimize routing method and support to define trace by axis or segment
  • Auto port generation, simplifies EM analysis setup
  • 3D-View makes the model check easier
  • Support parametric and optimization sweep simulation
  • Support export models to third-party tools, such as HFSS or CST
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