Metis – Fast Package and IC Co-simulation

Background

The simulation and optimization of passive radio frequency circuit need to take the electromagnetic field effect into account. With the increasing working frequency, the extraction of parasitic parameters becomes more and more important.Traditional formula analytic method cannot accurately considering the skin effect and the effect of substrate loss, but efficient 3D EM simulation software of the simulation data can be more close to reality, because of its full consideration of the high frequency characteristic and device fabrication process parameters of the change, thus greatly improving the success rate of plate and the designer’s confidence.

Product Introduction

Metis is based on a 3d-accelerated MoM electromagnetic field simulation engine technology, which provides the most efficient solution for chip level encapsulation and chip/encapsulation in cross-scale joint simulation covering nanometer to centimeter-level. Metis offers a fast way to enable die-interposer-package co-simulation. Not only it is easy to assemble the IC and package together for co-simulation, but also its state-of-the-art fast solver engine gives order of magnitude speedup compared to competitor solutions. Metis supports the following scenarios: high speed serdes simulation between die and package, high speed DDR simulation between die and HBM.

The core solver used in Metis can significantly reduce EM simulation time and improve design efficiency. Metis provides an integrated design environment for large-scale 2.5-d silicon interposer signal integrity and power integrity issues, as well as integrated chip and package joint simulation in high-speed and high-frequency complex systems. The design process provided by Metis will greatly help RFIC designers to shorten the IC design cycle by enabling operations such as net refactoring, identification and selection, and allow users to quickly build SI and PI simulation models based on net information.

Highlights
  • Support GDSII, Allegro .brd/.mcm/*.sip import, and crop arbitrary area for simulation.
  • Optimized mesh to balance speed and accuracy, support rectangle and triangle mixed mesh to improve simulation speed and convergence.
  • SnpExpert provides powerful S-Parameter post-process capability.
Main Features
  • Metis provides an integrated design environment to simulate SI and PI for large scale silicon interposer, and simultaneously co-simulate the complete IC and package to identify their interactions
  • Accelerated 3D planar EM solver based on the Method of Moment (MoM) delivers the best performance in both speed and accuracy, and enable chip-level packaging and ICs/packages co-simulation across a range of scales from nanometer to centimeter
  • Support ICs and package co-simulation results back-annotated to Virtuoso and enable circuit level system simulation for both Windows and Linux platform
  • Support net reconstruction and net identifying, allows easy model building for SI and PI simulation
  • Support parallel processing techniques, including multi-threading processing and distributed processing to improve solver performance speedup and efficiency, and fully utilize hardware computing resources
  • Easy export Metis simulation project to HFSS with tuned simulation setting to ensure accuracy
What’s New in Metis 2019.01
  • Support large scale silicon interposer based SerDes and DDR simulation
  • Support IC/PKG co-simulation
  • Improve MOM Solver simulation efficiency with 1.7x speedup, and reduce memory consumption by 52%
  • Support automated 2D simulation flow for large scale silicon interposer and package design based on net selection
  • Unify simulation jobs submit and status monitor flow in “Submit Job” and “Job Manager” to support more user-friendly and real-time feedback batch run
  • Support multiple layout formats import and export to cover RFIC, MMIC and LTCC applications, including *.iris, *.dwg, *.dxf, *.gds, *.brd, *.sip, *.mcm, ODB++ and so on
  • Create a new design from existing nets or cutting areas to quick build simulation model
  • Enrich net related operations, including highlight net with different colors, show/hide nets and so on
  • Reduce time costing during loading and saving Metis project by using binary file format
  • Improve editing user-experience with full-functionality of Undo/Redo functionality
  • Support project auto-saving
  • Support automatically via defeaturing
  • Support to delete Shape
  • Support Undo/Redo function
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