Background

The skyrocketing growth of the wireless/mobile devices demands miniaturization, higher integration, and lower cost for the RF front end. While IC scaling with the advanced lithography does benefit the digital baseband system, it does not do the same to the RF front end, where passive components with surface mount device (SMD) technology account for 90% of the component count, 80% of the real estate size, and 70% of the cost.
Integrated Passive Devices (IPD) is such a technology to address this challenge.

Xpeedic IPD Solution

Xpeedic’s IPD technology allows designers to interconnect high-quality resistor, capacitor, and inductor on high resistivity silicon to realize the matching, filtering, or coupling functionality.

IPD has significant advantages over the conventional discrete passive devices:

  • Miniaturization
  • Higher Performance
  • Reduced Cost

Xpeedic has partnered with IPD foundries and developed the industry-leading design flow, which leads to first-pass silicon success.

Xpeedic IPD Library

Xpeedic provides full kinds of passive devices with IPD technology, including filters, baluns, couplers, attenuators and etc. with packages such as LGA, wire-bonding/flip-chip die, WLCSP and etc. for typical wireless communication applications.

Xpeedic Customized IPD Design Service

In many cases, IPDs are customized to meet the specific requirement from customers. With the help of the first-pass IPD design flow, Xpeedic is able to achieve fast turn-around for customized IPD. Multi passive functions can be integrated into one device and achieve higher level integration. More generally, with the Xpeedic EM expertise, IPDs can also be developed on substrate of GaAs, glass, SOI and etc.