Resources
Technical Documents

More Technical Documents

2022-05-06

Hermes 3D:3D Full-Wave Electromagnetic Simulation of Package and Board

2022-04-21

Experiment and Simulation Studies on Resonances due to Period Structure in PCBs

2022-04-21

High-Speed Digital SI/PI Simulation Platform

2022-04-21

A Complete EM Simulation Suite for On-Chip Passives in Advanced Nodes

2022-04-21

2.5D/3D IC Advanced Packaging Analysis Platform

2022-04-21

RF PCB EM-Circuit Co-simulation Platform

2019-02-28

Automated Crosstalk Scan, Impedance Scan and DRC+ for Signal Integrity Signoff

2019-02-28

Fast and Accurate Fiber Weave Modeling and Simulation

2019-02-28

Accurate Dk/Df Extraction for High-speed SI Applications

2018-02-28

IEEE P370 Compatible De-embedding and Quality Check for Measured S-parameters up to 50Ghz

2018-08-28

Combined IRIS-HFSS Flow for Passive Modeling and Verification in TowerJazz RF and HPA Nodes

2018-08-09

Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

2018-08-09

An Empirical Model for Foamed High-Speed Cable

2018-08-09

Integrating IRIS Plus in Nuhertz FilterSolutions to Enable Fast Filter Design

2018-08-09

Combined IRIS-HFSS Flow for Passive Modeling and Verification in Advanced Process Nodes

2018-08-09

Through Glass Via (TGV) Based Integrated Passive Device Technology for RF Front End Design

Design Videos

More Design Videos

2024-02-04

How to implement PCB board thermal simulation in Notus

2024-02-04

How to extract packaging RLGC parameters by X3D of Hermes

2024-02-04

How to implement fast DC simulation based on PowerTree

2024-02-04

How to add different ports in Metis

2024-02-04

How to perform electrothermal co-simulation in Notus

2024-02-04

How to create Coaxial Cable and run simulation in Hermes 3D

2024-02-04

How to use XHPC to improve simulation efficiency in XDS

2024-02-04

How to quickly reuse Module Routing in Genesis PCB

2024-01-17

Fast VTF Calculation of UCIe Protocol by SnpExpert

2022-05-06

Power Integrity DC Flow

2022-05-06

Channel Analysis Flow In High Speed Digital Design

2022-05-06

3D Flow in Metis

2021-03-24

TmlExpert: 2D, 2.5D, and 3D EM Analysis of Transmission Lines

2021-03-24

ChannelExpert: Analysis of Pre-Layout SerDes Channel

2021-03-24

Metis: Package Analysis Made Easy

2021-03-24

SnpExpert: Advanced Processing and Compliance

2021-03-24

ViaExpert: Post-Layout Via Modeling

2021-03-24

Heracles: Geometry Check beyond DRC in Allegro

2021-03-24

ViaExpert: Template-Based Via Modeling

2021-03-24

SnpExpert: De-embed S-parameters and Extract Dk and Df

Product Datasheet

More Product Datasheet

2023-02-27

Genesis: New Board-level System EDA Platform

2022-09-13

XDS: RF and Filter Design Analysis Software

2022-09-13

Metis: EM Simulation Software for Advanced Package Design

2022-09-12

Hermes PSI: SI/PI/Thermal Simulation Platform

2022-09-12

IRIS: Fast EM Simulation with Virtuoso Integration

2022-09-12

ViaExpert: 3D Via Modeling and Simulation

2022-09-11

JobQueue: Simulation Job Management Platform

2022-09-11

TmlExpert: Transmission Line Modeling and Simulation

2022-09-11

iModeler: Fast PDK Model Generation

2022-09-11

CableExpert: Fast and Accurate Cable Modeling and Simulation

2022-09-10

Hermes 3D: High Speed PCB Signal Integrity Analysis

2022-09-10

ChannelExpert: High Speed Channel Exploration

2022-09-10

SnpExpert: S-Parameter Exploration

2022-09-09

Heracles: Automated SI Signoff for High Speed Design

2022-09-09

iVerifier: RF Passive PDK Verification

2022-09-08

LibManager: Library Management Platform

Paper Publication

More Paper Publication

2023-03-30

Automatic Synthesis for On-chip Transformer

2023-03-30

Experiment and Simulation Studies on Resonances due to Period Structure in PCBs

2023-03-30

Signal Integrity Analysis in Immersion Liquid Cooling

2023-03-30

Optimizing BGA Ball Pattern for Signal Integrity

2023-03-30

Skew Measurement of High-Speed Connector