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芯禾科技参展2015年国际微波会议并组织射频系统小型化研讨会

苏州 2015.5.8

2015年国际微波会议(IMS 2015)将于2015年5月17-22日在美国亚利桑那州凤凰城(Phoenix)举办。IMS 是IEEE微波理论与技术协会(MTT-S)一年一度的会议及展览活动,也是全球最大规模的微波展览与技术会议。芯禾科技董事长凌峰博士提议并组织的题为“通过集成无源器件、硅通孔技术和系统级封装实现射频系统小型化 RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies"的研讨会获得组委会通过,将担任这一全天的研讨会的主席。本次研讨会汇集了这一领域的来自Xpeedic, Skyworks, STMicroelectronics, ON Semi, Amkor, STATS ChipPAC, IPDiA, Mentor Graphics的顶级专家,就如何实现射频系统小型化从不同方面进行有益的探讨,7篇演讲的具体内容可以访问  http://www.ims2015.org/workshops/6-technical-program/technical-program-general-content/254-sunday-workshop-descriptions#WSK

芯禾科技同时还将携旗下的射频集成电路EDA软件、集成无源器件和封装级系统的小型化方案参展本次峰会,展台号是#2612.

关于芯禾科技

芯禾科技是EDA软件、集成无源器件和系统级封装领域的领先供应商,致力于为半导体芯片设计公司和系统厂商提供差异化的软件产品和芯片小型化解决方案,这些产品和方案可以应用到智能手机、平板电脑和可穿戴等移动设备上,也可以应用到高速数据通信设备上。

www.xpeedic.com

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IMS2015

Date: May 17-22, 2015
Location: Phoenix, AZ

Xpeedic Technology, Inc. will exhibit at the IEEE MTT International Microwave Symposium (IMS) at Phoenix, AZ on May 17-22, 2015. The IMS is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice.

Xpeedic will exhibit at Booth #2612.

Dr. Feng Ling, CEO of Xpeedic Technology, and Nozad Karim, VP of Electrical Engineering at Amkor, will be hosting a full day work shop of “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies”.

For additional information on the conference, visit http://www.ims2015.org/

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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

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IMS 2014

Date:June 1-6, 2014.

Location: Florida

Xpeedic Technology, Inc. will exhibit at IMS 2014 in Tampa Bay, Florida on June 1-6, 2014. Xpeedic will showcase their EDA software, IPD and SiP solution in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS, iModeler, iVerifier, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designers and PDK engineers. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Visit Xpeedic at Booth #101 to find out more.

More details to see http://www.ims2014.org/

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Xpeedic to Exhibit at DesignCon 2014

Xpeedic Technology, Inc. will exhibit at DesignCon 2014 at Santa Clara on Jan. 28-31, 2014. Xpeedic will showcase their EDA software and System-in-Package (SiP) design service in the conference.

Xpeedic will bring fast and accurate signal integrity software for IC-package-system designs. ViaExpert enables fast via modeling and simulation for both pre-layout and post-layout scenarios. SnpExpert provides quick way to view S-parameter and the associated TDR. Hermes tool provides signal and power integrity simulation for complex IC-package-board designs including thru-silicon-via (TSV).

Xpeedic’s SiP design service enables customers to achieve system miniaturization by integrating ICs from different process into one package. Their IP on silicon integrated passive devices (IPD) empowers further miniaturization by integrating the peripheral passives for a broad range of RF applications.

Please visit Xpeedic at Booth #755 to find out more.