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Xpeedic Exhibits at IMS 2015 and Organizes a Full Day Workshop on RF System Miniaturization

Suzhou, 2015.5.8

The IEEE MTT-S International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as plenty of opportunities to meet and network with friends both new and old. The symposium also hosts the largest RF/Microwave commercial exhibition in the world with over 550 Companies. The IMS 2015 will be held at Phoenix, AZ on May 17-22, 2015.

Dr. Feng Ling, CEO of Xpeedic, will organize a full-day workshop titled as “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies” on May 17, 2015. The workshop assembles a group of well recognized experts  from Xpeedic, Skyworks, STMicroelectronics, Amkor, ON Semi, STATSChipPAC, IPDiA, and Mentor Graphics to share with the IMS attendees their approach for RF front end miniaturization. The experts represents all the aspects of the entire RF ecosystem ranging from IPD/TSV/Package foundries, design houses, to EDA tool vendors. More details can be found at  http://www.ims2015.org/workshops/6-technical-program/technical-program-general-content/254-sunday-workshop-descriptions#WSK

Xpeedic is proud to be an Exhibitor at the IMS 2015 and can be seen at Booth #2612.

Xpeedic will also exhibit at Booth #2612, showcasing their EDA tools, IPD and SiP solution to enable the RF front end miniaturization. Its EDA tool suite IRIS/iModeler/iVerifier, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designers and PDK engineers. Its silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

About Xpeedic
Xpeedic is a global supplier of EDA software, IPD, and turn-key SiP design solution to enable today’s innovation in RF and high speed digital designs. More information about the company, its products, and services is available at http://www.xpeedic.com.

IMS2015-Banner

IMS2015

Date: May 17-22, 2015
Location: Phoenix, AZ

Xpeedic Technology, Inc. will exhibit at the IEEE MTT International Microwave Symposium (IMS) at Phoenix, AZ on May 17-22, 2015. The IMS is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice.

Xpeedic will exhibit at Booth #2612.

Dr. Feng Ling, CEO of Xpeedic Technology, and Nozad Karim, VP of Electrical Engineering at Amkor, will be hosting a full day work shop of “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies”.

For additional information on the conference, visit http://www.ims2015.org/

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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

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IMS 2014

Date:June 1-6, 2014.

Location: Florida

Xpeedic Technology, Inc. will exhibit at IMS 2014 in Tampa Bay, Florida on June 1-6, 2014. Xpeedic will showcase their EDA software, IPD and SiP solution in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS, iModeler, iVerifier, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designers and PDK engineers. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Visit Xpeedic at Booth #101 to find out more.

More details to see http://www.ims2014.org/

DesignCon2014-Banner

Xpeedic to Exhibit at DesignCon 2014

Xpeedic Technology, Inc. will exhibit at DesignCon 2014 at Santa Clara on Jan. 28-31, 2014. Xpeedic will showcase their EDA software and System-in-Package (SiP) design service in the conference.

Xpeedic will bring fast and accurate signal integrity software for IC-package-system designs. ViaExpert enables fast via modeling and simulation for both pre-layout and post-layout scenarios. SnpExpert provides quick way to view S-parameter and the associated TDR. Hermes tool provides signal and power integrity simulation for complex IC-package-board designs including thru-silicon-via (TSV).

Xpeedic’s SiP design service enables customers to achieve system miniaturization by integrating ICs from different process into one package. Their IP on silicon integrated passive devices (IPD) empowers further miniaturization by integrating the peripheral passives for a broad range of RF applications.

Please visit Xpeedic at Booth #755 to find out more.