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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

DesignCon2014-Banner

Xpeedic to Exhibit at DesignCon 2014

Xpeedic Technology, Inc. will exhibit at DesignCon 2014 at Santa Clara on Jan. 28-31, 2014. Xpeedic will showcase their EDA software and System-in-Package (SiP) design service in the conference.

Xpeedic will bring fast and accurate signal integrity software for IC-package-system designs. ViaExpert enables fast via modeling and simulation for both pre-layout and post-layout scenarios. SnpExpert provides quick way to view S-parameter and the associated TDR. Hermes tool provides signal and power integrity simulation for complex IC-package-board designs including thru-silicon-via (TSV).

Xpeedic’s SiP design service enables customers to achieve system miniaturization by integrating ICs from different process into one package. Their IP on silicon integrated passive devices (IPD) empowers further miniaturization by integrating the peripheral passives for a broad range of RF applications.

Please visit Xpeedic at Booth #755 to find out more.