文章

Banner

芯禾科技受邀参展EDI CON China 2016

日期:2016年4月19-21日
地点:北京,国家会议中心
展位号:432

芯禾科技受邀将于2016年4月19-21日参加在北京国家会议中心举办的2016 EDI CON China(电子设计创新会议)中国大会。

EDI CON中国大会由欧洲微波杂志和中国国际贸易促进委员会商业行业分会主办,中国雷达学会及中国电工技术学会协办,为设计工程师和系统集成商提供针对当 今通信、计算、RFID、无线、导航、航空航天及相关市场的最新射频/微波和高速数字产品和技术信息。这项一年一度的盛事汇集了中国创新前沿和世界领先跨国科技公司的设计师和全球领先的射频、微波、高速模拟和混合信号元器件、半导体、测试和测量设备、材料和封装、EDA/CAD和系统解决方案供应商,是华北地区最大的微波射频无线展览与技术会议。

芯禾科技在本届大会上将主要展示RFIC射频芯片设计的整合解决方案,包括无线射频IPD集成无源器件、EDA设计工具和SiP系统级封装服务的三大产品线。

Backdrop

芯禾科技的IPD采用先进的片上无源器件工艺,为客户提供了标准和定制化元件库,可应用于智能手机、物联网等多个领域;用于RFIC设计的EDA工具集,内嵌基于矩量法的三维全波电磁场仿真器,全面考虑导体趋肤效应、临近效应以及介质损耗等。它与Virtuoso无缝集成,且支持多核分布式并行计算的核心求解器,大大降低EM仿真时间、提高了设计效率;以IPD为特色的SiP封装设计一站式服务,在有效缩小系统体积的同时,提升产品性能,缩短了产品投放市场周期和生产费用。

了解更多信息,请访问http://www.mwjournalchina.com/edicon/

Common Banner

芯禾科技获“中芯国际和上海物联网创投基金”联合投资 加速国内芯片小型化设计产业腾飞

2015年8月6日,中国苏州讯——EDA软件、集成无源器件IPD和系统级封装领域的全球供应商苏州芯禾电子科技有限公司,近日召开签约仪式,正式接受来自中芯国际旗下的中芯聚源东方基金和上海物联网创投基金的联合投资。

作为苏州市吴江区人才引进成功扶植的高科技企业,吴江区常委、开发区党工委副书记、开发区管委会副主任吴新明亲自出席了芯禾科技的投资签约仪式,他说:“我们很高兴看到芯禾科技这颗‘禾苗’经过四年时间在吴江科创园的孵化,今天已经成长为半导体集成电路和微系统设计领域、中国乃至国际上一颗冉冉升起的明星。今天中芯聚源总额达两个亿的半导体基金正式投向吴江,并与上海物联网基金联合投资芯禾科技四千万元,标志着芯禾科技的技术和产品获得了行业的高度认可,也将推动芯禾科技在人才储备、产品研发和市场开拓方面迎来又一波发展高峰。吴江经济技术开发区将继续秉持“亲商、安商、富商”的服务理念,为芯禾科技在吴江的发展提供最优质、高效的服务,助推企业发展壮大。

芯禾科技重要战略合作伙伴、本次投资人之一中芯聚源的孙玉望总裁说:“随着高速无线通信尤其是4G LTE网络等的发展和广泛应用,移动设备的射频前端日益复杂,这对设计提出了诸多挑战。芯禾科技专注的集成无源器件相较传统的分立元器件,拥有小型化、高性能和低成本等多项显著优势。中芯国际已经与芯禾科技合作了多年,并共同开发了业界领先的设计、工艺和加工流程,仅需一次流片即可达成设计目标,所以我们非常看好芯禾科技在未来几年的发展。”
中科院微系统所旗下的上海物联网创投基金合伙人王晓蕾说:“随着物联网行业的蓬勃兴起,中国智能终端开发的热潮不断发酵。然而我们面对的现实是,大多数智能终端开发的基础工具和器件都为国外大公司所垄断。芯禾科技是我们看到的为数不多的几家在EDA、IPD领域可以和国外大公司一较高下、且有自己独特优势的国内厂商,未来的发展空间不可限量。”

中国半导体协会集成电路分会副理事长兼秘书长于燮康坦言道:“半导体行业面对小型化的挑战由来已久,目前主流的解决方案是系统芯片SoC,但在技术上把数字、模拟、RF、微波等功能集成在同一芯片上,会存在许多工艺兼容的问题;另外,由于系统复杂、产品研发周期长,设计错误、产品延迟和芯片制造反复等因素也会导致成本增加。芯禾科技专注的系统级封装SiP解决方案提出了一种创新的思路,将具有不同功能的芯片在三维空间内进行多种形式的组合安装,混合搭载于同一封装体之内,构成了完整系统的封装技术。不仅有效地缩小了系统体积,还大大提升了产品性能,值得在行业里推广”

芯禾科技首席执行官凌峰博士表示:“为了响应国家对于集成电路、物联网领域发展的号召,芯禾科技在苏州吴江区政府的大力扶持下,经过四年的艰苦创业,在微系统设计和芯片小型化解决方案方面已经取得突破性的进展。作为国内唯一一家仿真类EDA软件提供商、国内唯一从事集成无源器件IPD和SiP研发的高科技企业,行业内标杆基金的投资对我们是一种高度的激励,下一步,我们将更紧密地和中芯国际等行业内的领先企业紧密合作,为振兴吴江乃至整个中国的集成电路产业创造我们的价值。”

ICCAD2014-Banner

ICCAD 2014

Date:Dec. 11-12, 2014.

Location: Hong Kong

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2014 Annual Conference at Hong Kong on Dec. 11-12, 2014.
At Dec 12, Dr.Wenliang Dai, Engineering VP, will present the leading design method-“RFSiP Miniaturization by Integrated Passive Devices(IPD)” with IC industry companion in ICCAD Subject Forum 3.
At booth 1F#21-22,Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

The conference official  website:
http://www.csia-iccad.net.cn/
http://www.cicmag.com/bbx/856303-856303.html

SMIC 2014-Banner

SMIC 2014 Technology Symposium in Shanghai

Date: Sept. 18, 2014.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.

IRIS-Banner

Xpeedic Announces Release of IRIS Platform Version 2014.01

Suzhou, China. -Jul. 30, 2014 -Xpeedic today releases three enhanced solutions (IRIS, iModeler and iVerifier) under IRIS platform version 2014.01 which will greatly accelerate RFIC passive extraction, PDK model generation and verification.  In the latest release of IRIS platform,  the mesh and solver technologies are further improved along with the new features such as auto HFSS project export and frequency and temperature dependent material support.

IRIS 2014.01 solution helps RFIC designers to quickly simulate the passives and interconnects of interest and then verify the design by automatically back-annotating the EM simulation to schematic. The solution greatly helps RFIC designers to reduce the design cycle and achieve first-pass silicon success.

iModeler 2014.01 solution accelerates the PDK model generation by built-in parameterized layout for passive devices and fast IRIS mesh and solver technologies.

iVerifier 2014.01 solution enables users to assess the PDK model quality by sweeping the parameters and evaluating the key metrics of the PDK elements.

ICCAD2013-Banner

Xpeedic to Exhibit at CSIA-ICCAD 2013

Xpeedic Technology, Inc. will exhibit at ICCAD 2013 in Hefei, Anhui Province, China on Oct 10-11, 2013. Xpeedic will show their EDA software and IPD IP in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS and iModeler, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designs. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Please visit Xpeedic at Booth #25-26 to find out more.

Dr. Wenliang Dai, VP of Engineering of Xpeedic, will present the following paper in Subject Forum (II).

Paper: 3D IC Integration with TSV EDA, IPD Chip, and SiP Technology
Presenter: Wenliang Dai, PhD
When: 13:00-13:25, Friday, Oct. 11, 2013
Where: Floor 3, Room 2, Anhui Int’l Convention and Exhibition Center

More detail…

SMIC 2013-Banner

Xpeedic to Exhibit at SMIC Technology Symposium 2013

Xpeedic will be exhibiting at the SMIC 2013 Technology Symposium in Shanghai on Sept, 04, 2013. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #19 to find out more.

ICCAD2012-Banner

Xpeedic to Exhibit at CSIA-ICCAD 2012 Annual Conference & Chongqing IC Leapfrog Development Summit Forum

The 18th ICCAD 2012 will be held in Chongqing, China on December 6-7, 2012. The theme of this year is Development and Innovation, Executing Advantages, Optimization of Industrial Structure, and Creating a Leading Electronic Information Industry.

Dr. Wenliang Dai will have a technical presentation “Xpeedic RFIC and 3DIC Design & Simulation Platform” in IP and IC Design Session at 17:00-17:30 on Dec 7, Friday, 2012.

Please visit Xpeedic in booth B01-02 at the second floor at Chongqing International Conference & Exhibition Center on December 6-7, 2012. More detail…

ICMMT-Banner

Xpeedic will participate in ICMMT2012

Xpeedic will participate in ICMMT2012 May 5 – 8 in Shenzhen, China.  Xpeedic will have exhibition at booth B30 – B32.  Xpeedic will make speech and draw lucky visitors at 15:40 pm, May 6. more…

Xpeedic Speech Title:  Fast 3D electromagnetic simulation tool based on the Cadence Virtuoso– IRIS

Abstract: IRIS provides RFIC designers a EM simulation tool based on Cadence Virtuoso software environment. It uses full-wave 3D fast method of moments to improve the simulation speed and the efficiency of IC design. Being perfect compatibility with Cadence Virtuoso, IRIS’s optimization of the mesh function can combine the simulation accuracy and speed. The function of back annotation realizes the perfect convergence of RFIC design from front-end to back-end and return to the front-end. At the same time, IRIS supports distributed and multi-thread parallel computing.