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芯禾科技硅谷运营中心成立,深耕北美、拥抱全球

2017年2月8日,美国加州讯——EDA软件、集成无源器件IPD和系统级封装领域的全球供应商芯禾科技(Xpeedic Technology Inc.),近日宣布在美国加州正式成立其硅谷运营中心。该中心将主要负责公司在美国市场的EDA产品销售和技术支持。

芯禾科技创建于2010年,之前在中国苏州,中国上海和美国西雅图都设有办公室。作为EDA软件、集成无源器件IPD和系统级封装领域的佼佼者,芯禾科技致力于为半导体芯片设计公司和系统厂商提供差异化的软件产品和芯片小型化解决方案:

  • 高效的模拟/混合信号IC软件工具集能提供工程师在最先进的半导体工艺平台上实现更快的设计流程和更短的设计周期;
  • 多项填补行业空白的信号完整性软件工具集能帮助IC、封装和PCB系统工程师实现更快的设计交付;
  • 飞速拓展的集成无源器件(IPD)IP库能为射频前端模块的系统级封装设计(SiP)兼容并包业界顶尖的性能和整合性。

这些产品和解决方案已被多家厂商广泛地应用到智能手机、物联网设备以及计算和网络系统设备上。

凭借以客户需求驱动发展的理念,芯禾科技近年来赢得了众多客户的青睐,继成为中国集成电路自动化软件技术和微电子技术行业的标杆企业之一之后,又在全球市场取得突破,成为众多行业国际巨头的指定EDA工具供应商。

此番硅谷运营中心的成立,既对现有国际客户提供了更近距离的服务支持,也彰显了芯禾科技继续耕作北美乃至全球市场的决心。

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芯禾科技受邀参展EDI CON China 2016

日期:2016年4月19-21日
地点:北京,国家会议中心
展位号:432

芯禾科技受邀将于2016年4月19-21日参加在北京国家会议中心举办的2016 EDI CON China(电子设计创新会议)中国大会。

EDI CON中国大会由欧洲微波杂志和中国国际贸易促进委员会商业行业分会主办,中国雷达学会及中国电工技术学会协办,为设计工程师和系统集成商提供针对当 今通信、计算、RFID、无线、导航、航空航天及相关市场的最新射频/微波和高速数字产品和技术信息。这项一年一度的盛事汇集了中国创新前沿和世界领先跨国科技公司的设计师和全球领先的射频、微波、高速模拟和混合信号元器件、半导体、测试和测量设备、材料和封装、EDA/CAD和系统解决方案供应商,是华北地区最大的微波射频无线展览与技术会议。

芯禾科技在本届大会上将主要展示RFIC射频芯片设计的整合解决方案,包括无线射频IPD集成无源器件、EDA设计工具和SiP系统级封装服务的三大产品线。

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芯禾科技的IPD采用先进的片上无源器件工艺,为客户提供了标准和定制化元件库,可应用于智能手机、物联网等多个领域;用于RFIC设计的EDA工具集,内嵌基于矩量法的三维全波电磁场仿真器,全面考虑导体趋肤效应、临近效应以及介质损耗等。它与Virtuoso无缝集成,且支持多核分布式并行计算的核心求解器,大大降低EM仿真时间、提高了设计效率;以IPD为特色的SiP封装设计一站式服务,在有效缩小系统体积的同时,提升产品性能,缩短了产品投放市场周期和生产费用。

了解更多信息,请访问http://www.mwjournalchina.com/edicon/

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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

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SMIC 2014 Technology Symposium in Shanghai

Date: Sept. 18, 2014.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.

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Xpeedic Announces Release of IRIS Platform Version 2014.01

Suzhou, China. -Jul. 30, 2014 -Xpeedic today releases three enhanced solutions (IRIS, iModeler and iVerifier) under IRIS platform version 2014.01 which will greatly accelerate RFIC passive extraction, PDK model generation and verification.  In the latest release of IRIS platform,  the mesh and solver technologies are further improved along with the new features such as auto HFSS project export and frequency and temperature dependent material support.

IRIS 2014.01 solution helps RFIC designers to quickly simulate the passives and interconnects of interest and then verify the design by automatically back-annotating the EM simulation to schematic. The solution greatly helps RFIC designers to reduce the design cycle and achieve first-pass silicon success.

iModeler 2014.01 solution accelerates the PDK model generation by built-in parameterized layout for passive devices and fast IRIS mesh and solver technologies.

iVerifier 2014.01 solution enables users to assess the PDK model quality by sweeping the parameters and evaluating the key metrics of the PDK elements.

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Xpeedic to Exhibit at DesignCon 2014

Xpeedic Technology, Inc. will exhibit at DesignCon 2014 at Santa Clara on Jan. 28-31, 2014. Xpeedic will showcase their EDA software and System-in-Package (SiP) design service in the conference.

Xpeedic will bring fast and accurate signal integrity software for IC-package-system designs. ViaExpert enables fast via modeling and simulation for both pre-layout and post-layout scenarios. SnpExpert provides quick way to view S-parameter and the associated TDR. Hermes tool provides signal and power integrity simulation for complex IC-package-board designs including thru-silicon-via (TSV).

Xpeedic’s SiP design service enables customers to achieve system miniaturization by integrating ICs from different process into one package. Their IP on silicon integrated passive devices (IPD) empowers further miniaturization by integrating the peripheral passives for a broad range of RF applications.

Please visit Xpeedic at Booth #755 to find out more.

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Xpeedic to Exhibit at SMIC Technology Symposium 2013

Xpeedic will be exhibiting at the SMIC 2013 Technology Symposium in Shanghai on Sept, 04, 2013. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #19 to find out more.

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Xpeedic At IEEE EDAPS 2011

Suzhou, China — Nov. 28, 2011
 
Xpeedic Technology, Inc. will at IEEE EDAPS 2011, being held at Hangzhou, China on Dec. 12-14, 2011. Feng Ling, Founder/CEO of Xpeedic Technology, Inc. will organize a special workshop “EDA Solution for Chip, Package, and Board Designs”. Leading EDA vendors will present their solutions on various topics including TSV modeling, SI/PI simulation, co-simulation, and channel analysis. Dr. Wenliang Dai, VP of Engineering of Xpeedic Technology, Inc.,  will deliver the speech titled “Enabling Optimal Channel Performance by Interconnect Tuning”.