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Xpeedic Opens its Sillicon Valley Operation Center

Silicon Valley, US. — Feb 2, 2017 —Xpeedic Technology, Inc., a global leading provider of EDA software has announced to open its Silicon Valley operation center to best serve the needs of the customers and partners in north America market. The new operation center will deliver both the regional sales and technical support functions.

Founded in 2010, Xpeedic has long-established sales presence in China and offices in both US and China. Xpeedic is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

This initiative is following customer-oriented company strategy, and will not only allow Xpeedic to be closer to customers in key markets, it will also provide the opportunity to work closer with strategic partners and keep Xpeedic with the latest advanced industry nodes.

About Xpeedic

Xpeedic Technology, Inc. is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. These tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

Founded in 2010, Xpeedic has offices in both US and China. For more information, please visit www.xpeedic.com.

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Xpeedic to Exhibit at EDI CON China 2016

Date: Apr 19-21, 2016.
Location: Beijing, China
Booth: 432

EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

More details to see http://ediconchina.com/default.asp

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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

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SMIC 2014 Technology Symposium in Shanghai

Date: Sept. 18, 2014.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.

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Xpeedic Announces Release of IRIS Platform Version 2014.01

Suzhou, China. -Jul. 30, 2014 -Xpeedic today releases three enhanced solutions (IRIS, iModeler and iVerifier) under IRIS platform version 2014.01 which will greatly accelerate RFIC passive extraction, PDK model generation and verification.  In the latest release of IRIS platform,  the mesh and solver technologies are further improved along with the new features such as auto HFSS project export and frequency and temperature dependent material support.

IRIS 2014.01 solution helps RFIC designers to quickly simulate the passives and interconnects of interest and then verify the design by automatically back-annotating the EM simulation to schematic. The solution greatly helps RFIC designers to reduce the design cycle and achieve first-pass silicon success.

iModeler 2014.01 solution accelerates the PDK model generation by built-in parameterized layout for passive devices and fast IRIS mesh and solver technologies.

iVerifier 2014.01 solution enables users to assess the PDK model quality by sweeping the parameters and evaluating the key metrics of the PDK elements.

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Xpeedic to Exhibit at DesignCon 2014

Xpeedic Technology, Inc. will exhibit at DesignCon 2014 at Santa Clara on Jan. 28-31, 2014. Xpeedic will showcase their EDA software and System-in-Package (SiP) design service in the conference.

Xpeedic will bring fast and accurate signal integrity software for IC-package-system designs. ViaExpert enables fast via modeling and simulation for both pre-layout and post-layout scenarios. SnpExpert provides quick way to view S-parameter and the associated TDR. Hermes tool provides signal and power integrity simulation for complex IC-package-board designs including thru-silicon-via (TSV).

Xpeedic’s SiP design service enables customers to achieve system miniaturization by integrating ICs from different process into one package. Their IP on silicon integrated passive devices (IPD) empowers further miniaturization by integrating the peripheral passives for a broad range of RF applications.

Please visit Xpeedic at Booth #755 to find out more.

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Xpeedic At IEEE EDAPS 2011

Suzhou, China — Nov. 28, 2011
 
Xpeedic Technology, Inc. will at IEEE EDAPS 2011, being held at Hangzhou, China on Dec. 12-14, 2011. Feng Ling, Founder/CEO of Xpeedic Technology, Inc. will organize a special workshop “EDA Solution for Chip, Package, and Board Designs”. Leading EDA vendors will present their solutions on various topics including TSV modeling, SI/PI simulation, co-simulation, and channel analysis. Dr. Wenliang Dai, VP of Engineering of Xpeedic Technology, Inc.,  will deliver the speech titled “Enabling Optimal Channel Performance by Interconnect Tuning”.