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IMS2015

Date: May 17-22, 2015
Location: Phoenix, AZ

Xpeedic Technology, Inc. will exhibit at the IEEE MTT International Microwave Symposium (IMS) at Phoenix, AZ on May 17-22, 2015. The IMS is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice.

Xpeedic will exhibit at Booth #2612.

Dr. Feng Ling, CEO of Xpeedic Technology, and Nozad Karim, VP of Electrical Engineering at Amkor, will be hosting a full day work shop of “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies”.

For additional information on the conference, visit http://www.ims2015.org/

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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

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ICCAD 2014

Date:Dec. 11-12, 2014.

Location: Hong Kong

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2014 Annual Conference at Hong Kong on Dec. 11-12, 2014.
At Dec 12, Dr.Wenliang Dai, Engineering VP, will present the leading design method-“RFSiP Miniaturization by Integrated Passive Devices(IPD)” with IC industry companion in ICCAD Subject Forum 3.
At booth 1F#21-22,Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

The conference official  website:
http://www.csia-iccad.net.cn/
http://www.cicmag.com/bbx/856303-856303.html

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IMS 2014

Date:June 1-6, 2014.

Location: Florida

Xpeedic Technology, Inc. will exhibit at IMS 2014 in Tampa Bay, Florida on June 1-6, 2014. Xpeedic will showcase their EDA software, IPD and SiP solution in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS, iModeler, iVerifier, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designers and PDK engineers. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Visit Xpeedic at Booth #101 to find out more.

More details to see http://www.ims2014.org/

DesignCon2014-Banner

Xpeedic to Exhibit at DesignCon 2014

Xpeedic Technology, Inc. will exhibit at DesignCon 2014 at Santa Clara on Jan. 28-31, 2014. Xpeedic will showcase their EDA software and System-in-Package (SiP) design service in the conference.

Xpeedic will bring fast and accurate signal integrity software for IC-package-system designs. ViaExpert enables fast via modeling and simulation for both pre-layout and post-layout scenarios. SnpExpert provides quick way to view S-parameter and the associated TDR. Hermes tool provides signal and power integrity simulation for complex IC-package-board designs including thru-silicon-via (TSV).

Xpeedic’s SiP design service enables customers to achieve system miniaturization by integrating ICs from different process into one package. Their IP on silicon integrated passive devices (IPD) empowers further miniaturization by integrating the peripheral passives for a broad range of RF applications.

Please visit Xpeedic at Booth #755 to find out more.

ICCAD2013-Banner

Xpeedic to Exhibit at CSIA-ICCAD 2013

Xpeedic Technology, Inc. will exhibit at ICCAD 2013 in Hefei, Anhui Province, China on Oct 10-11, 2013. Xpeedic will show their EDA software and IPD IP in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS and iModeler, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designs. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Please visit Xpeedic at Booth #25-26 to find out more.

Dr. Wenliang Dai, VP of Engineering of Xpeedic, will present the following paper in Subject Forum (II).

Paper: 3D IC Integration with TSV EDA, IPD Chip, and SiP Technology
Presenter: Wenliang Dai, PhD
When: 13:00-13:25, Friday, Oct. 11, 2013
Where: Floor 3, Room 2, Anhui Int’l Convention and Exhibition Center

More detail…

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Xpeedic to Exhibit at IMS/RFIC 2013

Xpeedic Technology, Inc. will exhibit at IMS/RFIC 2013 in Seattle on June 2-7, 2013. Xpeedic will showcase their EDA software and IP in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS and iModeler, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designs. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Visit Xpeedic at Booth #1536 to find out more.

The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as a full set of social events. The symposium also hosts a huge commercial exhibition, organized by MP Associates.

The IEEE MTT-S Microwave Week has several conferences that are co-located at the same venues. Besides the flagship IMS Conference, Microwave Week also hosts the IEEE RFIC and ARFTG conferences. To view more information on their programs, please visit http://www.rfic2013.org and http://www.arftg.org. Registration and hotel accommidations for Microwave Week will be handled by the IMS Steering Committee and MP Associates.

More details to see www.ims2013.org

ICCAD2012-Banner

Xpeedic to Exhibit at CSIA-ICCAD 2012 Annual Conference & Chongqing IC Leapfrog Development Summit Forum

The 18th ICCAD 2012 will be held in Chongqing, China on December 6-7, 2012. The theme of this year is Development and Innovation, Executing Advantages, Optimization of Industrial Structure, and Creating a Leading Electronic Information Industry.

Dr. Wenliang Dai will have a technical presentation “Xpeedic RFIC and 3DIC Design & Simulation Platform” in IP and IC Design Session at 17:00-17:30 on Dec 7, Friday, 2012.

Please visit Xpeedic in booth B01-02 at the second floor at Chongqing International Conference & Exhibition Center on December 6-7, 2012. More detail…

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Xpeedic Announces Passive PDK Design & Verification Tool iModeler V2012

Xpeedic iModeler provides RFIC designers a fast solution for RF passive design in Cadence Virtuoso platform. The solution employs a full-wave 3D EM solver with both multi-core and distributed parallelization feature that greatly reduces the EM simulation time. It includes several types of tools for modeling and parameter extraction which can deal with most cases. This software will make RF passive device design easier and increase the efficiency. More…

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Xpeedic to Present at CDNLive! Beijing 2012

Suzhou, China — Aug. 6, 2012

Xpeedic Technology, Inc. will present a technical paper at CDNLive! Beijing, China on Aug. 9th, 2012.

CDNLive! Beijing brings together Cadence technology users, developers, and industry experts to network, share best practices on critical design and verification issues, and discover new techniques for realizing advanced silicon, SoCs, and systems.

Paper:       SI/PI Applications in the Mixed Signal Circuit Design
Author:    Wenliang Dai, PhD
When:       5:05-5:30 PM, Thursday, Aug. 9, 2012
Where:     Shangri-La Hotel, Beijing, China
Website:  http://www.cadence.com/cdnlive/cn/2012/Pages/default.aspx