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Xpeedic Opens its Sillicon Valley Operation Center

Silicon Valley, US. — Feb 2, 2017 —Xpeedic Technology, Inc., a global leading provider of EDA software has announced to open its Silicon Valley operation center to best serve the needs of the customers and partners in north America market. The new operation center will deliver both the regional sales and technical support functions.

Founded in 2010, Xpeedic has long-established sales presence in China and offices in both US and China. Xpeedic is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

This initiative is following customer-oriented company strategy, and will not only allow Xpeedic to be closer to customers in key markets, it will also provide the opportunity to work closer with strategic partners and keep Xpeedic with the latest advanced industry nodes.

About Xpeedic

Xpeedic Technology, Inc. is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. These tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

Founded in 2010, Xpeedic has offices in both US and China. For more information, please visit www.xpeedic.com.

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Xpeedic Taiwan 2015 EDA Seminar is coming

Xpeedic Technology, Inc. will host an EDA seminar in Taipei, Taiwan on Oct.12, 2015.

High speed communication link design becomes more and more challenging because of the ever increasing data rate and the rapid development of semiconductor and IC technology. At multi-gigabit per second data rate, designers must characterize all the pieces in the signal path from transmit to receiver to address the signal integrity issues, including reflections, crosstalk, Simultaneous Switching Noise (SSN) and so on. Even a small discontinuity can significantly degrade the signal.

This seminar is targeting the SI engineers and to discuss fast and accurate way to model and simulate discontinuities along the path and optimize the channel performance. Xpeedic’s co-founder CEO Dr.Ling and VP engineering Dr. Dai will present within the seminar.

Detail agenda:

9:30-9:40 Welcome and Overview
9:40-10:10 S-parameter in high speed SI
10:10-10:40 Via modeling and optimization
10:40-11:00 Coffee/tea break
11:00-11:30 Impedance discontinuities from surface mounted pads
11:30-12:00 High speed channel modeling and optimization
12:00-13:00 Luck draw and Lunch

Venue: Conference center of National Taipei University of Technology
Contact: 02-2741-7655#201~202

If you have interest, please send email to Marketing@xpeedic.com for registration.

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EPEPS 2015

Date:Oct 25-28, 2015.
Location: San Jose, CA

Xpeedic to Exhibit at EPEPS 2015
EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.

Xpeedic will showcase its latest technology on EDA software, IPD and SiP solution. Xpeedic EDA software tools enables fast electromagnetic modeling and extraction. The IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

More details to see http://www.epeps.org/

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Xpeedic Announces Launch OF ChannelExpert Version 2015.01 for High Speed Channel Design

Shanghai, China. — July 13, 2015 —Xpeedic today unveils a new high speed channel design product: ChannelExpert Version 2015.01. ChannelExpert is a great addition to Xpeedic’s popular tools SnpExpert and ViaExpert. They provide SI engineers a better and efficient way to design today’s high speed digital circuitries.

High speed channel design is becoming more and more challenging because of the ever increasing data rate. At multi-gigabit per second data rate, channel designers must characterize all the pieces in the signal path from transmitter to receiver including connector, via, and trace, which are typically represented by either S-parameter blocks or RLGC transmission line (TML) model. Conventional SPICE-like circuit simulator has difficulty to efficiently handle the channel with mixed S-parameter and TML models, especially with large number of ports.

ChannelExpert provides a fast and accurate way to address the signal integrity issue arising from the cascaded network of S-parameter blocks and TML models. Its frequency domain cascading technology and 2D RLCG full wave transmission line solver enable quick and accurate channel simulation. Its intuitive graphic interface lets you easily design, analyze and optimize your high speed serial links for compliance with design standards.

“After the successful launch of first two tools, SnpExpert for S-parameter Exploration and ViaExpert for Via Modeling and Simulation, we are very excited to release ChannelExpert within our high speed signal integrity suite” said Dr. Feng Ling, CEO of Xpeedic. “With the increasing demand for more automated design flow, engineers feel that the traditional SI tools could not meet their goal in terms of efficiency and productivity. Xpeedic’s mission is to develop innovative tools and help engineers to break the technology barriers to design next generation electronic devices.”

Other highlights of ChannelExpert Version 2015.01 include:

  • Easy multiple channel creation by table with only one-click
  • Built-in substrate and stackup databases
  • Parametric S-Parameter and transmission line physical parameters for easy channel exploration
  • Integrate SnpExpert into ChannlExpert seamlessly to automate compliance check for popular standards like OIF CEI,IEEE 802.3 and others.

About Xpeedic
Xpeedic Technology, Inc. is a global leading provider of EDA software, IPD, and turn-key SiP design solution. The company is dedicated to help IC design customers with high performance EDA tools and differentiating electronic design service, including high speed digital designs, IC package designs, and RF analog mixed-signal designs. These tools and solutions are widely adopted by Smartphone, tablet, wearable devices and high speed data communication devices.
Founded in 2010, Xpeedic has offices in both US and China, Shanghai and Suzhou. For more information, please visit www.xpeedic.com.

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IMS2015

Date: May 17-22, 2015
Location: Phoenix, AZ

Xpeedic Technology, Inc. will exhibit at the IEEE MTT International Microwave Symposium (IMS) at Phoenix, AZ on May 17-22, 2015. The IMS is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice.

Xpeedic will exhibit at Booth #2612.

Dr. Feng Ling, CEO of Xpeedic Technology, and Nozad Karim, VP of Electrical Engineering at Amkor, will be hosting a full day work shop of “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies”.

For additional information on the conference, visit http://www.ims2015.org/

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H3C Adopts Xpeedic High Speed SI Solution

Santa Clara, California, Jan 26, 2015

Xpeedic Technology, Inc.(Xpeedic), a global supplier of EDA and IP solution in RF and high speed market, today announced that H3C, a leading IT infrastructure solution provider, has adopted its SI solution including SnpExpert and ViaExpert for their high speed designs. SnpExpert provides a quick way to assess the S-parameter model for connectors, packages, and systems. ViaExpert can create via models with order of magnitude faster than the traditional 3D full-wave solver with the aid of its proprietary 3D hybrid solver technology. These tools will be showcased in Xpeedic’s booth (#912) at this year’s DesignCon in Santa Clara, Calif., Jan 27-30, 2015.

“As the date rate continues to increase, high speed channel designs need accurately characterize every piece along the signal path. We need a more automated flow with ease of use while being accurate.” said Mingan Xiang, Manager for Interconnect Design Department at H3C. “Xpeedic’s EDA tools are tailored to our design needs. With their built-in productivity enhanced features, our SI engineers are able to perform their job more efficiently.”

“We are excited to see that the market leader like H3C adopts Xpeedic’s high speed SI solution.” said Dr. Feng Ling, CEO of Xpeedic. “With the increasing demand for more automated design flow, customers feel that the traditional SI tools could not meet their goal in terms of efficiency and productivity. For that reason, we have developed a suite of SI tools with a lot of built-in templates for the ease of use in addition to the proprietary fast electromagnetic technologies.”

About Xpeedic
Xpeedic provides EDA software, IP, and turn-key design solution to enable today’s innovation in RF and high speed digital designs. More information about the company, its products, and services is available at http://www.xpeedic.com.

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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

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ICCAD 2014

Date:Dec. 11-12, 2014.

Location: Hong Kong

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2014 Annual Conference at Hong Kong on Dec. 11-12, 2014.
At Dec 12, Dr.Wenliang Dai, Engineering VP, will present the leading design method-“RFSiP Miniaturization by Integrated Passive Devices(IPD)” with IC industry companion in ICCAD Subject Forum 3.
At booth 1F#21-22,Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

The conference official  website:
http://www.csia-iccad.net.cn/
http://www.cicmag.com/bbx/856303-856303.html

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Asian IBIS Summit (Shanghai)

Data:  Friday, Nov. 14, 2014.
Location:  Parkyard Hotel Shanghai, 699 Bibo Road, Zhangjiang Hi-Tech Park, Shanghai 201203, P.R. China

Xpeedic Technology, Inc. will participate the Asian IBIS Summit (Shanghai) on Nov. 14, 2014. Dr. Wenliang Dai, VP of Engineering of Xpeedic Technology, Inc.,  will deliver the following speech.
Paper:     Connector Via Footprint Optimization for 25Gbps Channel Design
Authors:  Wenliang Dai and Zhouxiang Su