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IC产业促进中心EDA服务平台引入“芯禾科技”软件

2015年12月24日,中国上海讯——EDA软件、集成无源器件IPD和系统级封装领域的全球供应商苏州芯禾电子科技有限公司,近日宣布与上海集成电路产业促进中心达成合作,将其旗下的EDA旗舰产品——高速信号完整性分析软件模组和射频IC设计模组正式加盟促进中心的EDA服务平台。

一直以来,EDA设计平台的相关的硬件设备价格较高,成为中小型及初创期的集成电路设计企业生存和发展的一个巨大瓶颈。为了推动整个集成电路设计行业的发展并为广大设计企业创造一个低成本、低风险的设计环境,上海集成电路技术与产业促进中心组建了EDA 软硬件平台,向前来使用的企业提供先进的软、硬件设计验证环境、严格的数据安全保密措施,以及完善的技术支持。

促进中心EDA平台的负责人说:“我们这个平台上目前只收纳经过行业应用验证的、具备工程师普及度、质量可靠的软件供应商。除了三大国际软件供应商——Synopsys, Cadence和Mentor Graphics, 平台还精挑细选了两家国内EDA领域的领头羊,芯禾科技位列其中。我们相信,和这些软件企业的合作,将帮助更多的中小企业使用到目前国际领先的解决方案”

随着电子技术和集成电路技术的不断进步,半导体工艺的迅猛发展以及人们对信息高速化、宽带化的需求,高速通信链路设计已经成为电子产品研制的一个重要环节,信号完整性问题也逐渐成为当今高速通信链路设计的一大挑战。芯禾科技CEO凌峰博士表示说:“如何处理由高速信号互连线引起的反射、串扰、开关噪声等信号完整性问题,确保信号传输的质量,是一个设计能否成功的关键。芯禾科技的高速信号完整性分析软件模组提供了业界领先的仿真技术,让SI工程师在设计的同时就能快速方便的对设计进行仿真和调试,大大提升了设计效率和设计周期,深受工程师的好评。我们希望通过这次合作,能够实实在在的帮助到国内电子行业的中小企业,用优秀的工具设计出跨时代的电子产品。”

芯禾科技此次加入促进中心EDA服务平台的软件模块包括:射频芯片设计验证工具IRIS,S参数处理和分析工具SnpExpert,三维过孔建模和分析工具ViaExpert及高速通道分析工具ChannelExpert。

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芯禾科技EDA台湾2015研讨会即将召开

日期:11月12日,2015
位置:中国,台北

随着电子技术和集成电路技术的不断进步,半导体工艺的迅猛发展以及人们对信息高速化、宽带化的需求,高速通信链路设计已经成为电子产品研制的一个重要环节,信号完整性问题也逐渐成为当今高速通信链路设计的一大挑战。

如何处理由高速信号互连线引起的反射、串扰、开关噪声等信号完整性问题,确保信号传输的质量,是一个设计能否成功的关键。 传统的设计方法无法实现较高的一次设计成功率,急需基于EDA软件进行SI仿真辅助设计的方法解决此问题。

为了帮助信号完整性分析设计领域的工程师更好的理解目前面临的各种挑战,以及国内外主要的解决方案,芯禾科技将于2015年11月12日在台北举行EDA台湾2015研讨会。芯禾科技的两位创始人CEO凌峰博士和工程副总裁代文亮博士将会携核心技术团队亲临活动现场和大家交流。

具体日程安排如下:
9:30-9:40 Welcome and Overview
9:40-10:10 S-parameter in high speed SI
10:10-10:40 Via modeling and optimization
10:40-11:00 Coffee/tea break
11:00-11:30 Impedance discontinuities from surface mounted pads
11:30-12:00 High speed channel modeling and optimization
12:00-13:00 Luck draw and Lunch

会场地点:集思北科大会议中心 台北市忠孝东路三段197号旁 (台北科技大学 億光大楼2~3楼 )
电话:02-2741-7655#201~202

有兴趣的工程师,可发送邮件至marketing@xpeedic.com 报名参加。

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EPEPS 2015

日期:10月25-28日,2015
位置:美国,加州,圣何塞

芯禾科技受邀将于2015年10月25-28日参加在美国加利福尼亚州圣何塞市举办的2015 EPEPS大会。

EPEPS大会是探讨电气建模、分析和电子互连、封装和系统设计方面的热门问题的最重要的国际会议。它还侧重于探讨应用于评估和确保高速设计中信号、电源和散热完整性的各种新方法和设计技术。

芯禾科技将在此次大会上展示其在EDA软件、IPD和SiP解决方案方面的最新研发成果。芯禾科技的EDA软件工具能支持快速电磁建模和提取,而硅基集成无源器件(IPD),通过业界领先的性能和集成组合,能在多个领域里实现系统级封装(SiP)的应用。

了解更多信息,请访问http://www.epeps.org/

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芯禾科技参展2015年国际微波会议并组织射频系统小型化研讨会

苏州 2015.5.8

2015年国际微波会议(IMS 2015)将于2015年5月17-22日在美国亚利桑那州凤凰城(Phoenix)举办。IMS 是IEEE微波理论与技术协会(MTT-S)一年一度的会议及展览活动,也是全球最大规模的微波展览与技术会议。芯禾科技董事长凌峰博士提议并组织的题为“通过集成无源器件、硅通孔技术和系统级封装实现射频系统小型化 RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies"的研讨会获得组委会通过,将担任这一全天的研讨会的主席。本次研讨会汇集了这一领域的来自Xpeedic, Skyworks, STMicroelectronics, ON Semi, Amkor, STATS ChipPAC, IPDiA, Mentor Graphics的顶级专家,就如何实现射频系统小型化从不同方面进行有益的探讨,7篇演讲的具体内容可以访问  http://www.ims2015.org/workshops/6-technical-program/technical-program-general-content/254-sunday-workshop-descriptions#WSK

芯禾科技同时还将携旗下的射频集成电路EDA软件、集成无源器件和封装级系统的小型化方案参展本次峰会,展台号是#2612.

关于芯禾科技

芯禾科技是EDA软件、集成无源器件和系统级封装领域的领先供应商,致力于为半导体芯片设计公司和系统厂商提供差异化的软件产品和芯片小型化解决方案,这些产品和方案可以应用到智能手机、平板电脑和可穿戴等移动设备上,也可以应用到高速数据通信设备上。

www.xpeedic.com

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IMS2015

Date: May 17-22, 2015
Location: Phoenix, AZ

Xpeedic Technology, Inc. will exhibit at the IEEE MTT International Microwave Symposium (IMS) at Phoenix, AZ on May 17-22, 2015. The IMS is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice.

Xpeedic will exhibit at Booth #2612.

Dr. Feng Ling, CEO of Xpeedic Technology, and Nozad Karim, VP of Electrical Engineering at Amkor, will be hosting a full day work shop of “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies”.

For additional information on the conference, visit http://www.ims2015.org/

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ICCAD 2014

Date:Dec. 11-12, 2014.

Location: Hong Kong

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2014 Annual Conference at Hong Kong on Dec. 11-12, 2014.
At Dec 12, Dr.Wenliang Dai, Engineering VP, will present the leading design method-“RFSiP Miniaturization by Integrated Passive Devices(IPD)” with IC industry companion in ICCAD Subject Forum 3.
At booth 1F#21-22,Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

The conference official  website:
http://www.csia-iccad.net.cn/
http://www.cicmag.com/bbx/856303-856303.html

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Xpeedic Announces Release of SnpExpert and ViaExpert 2014.02

Suzhou, China. —Sep. 30, 2014 —Xpeedic today unveils two enhanced solution in the area of high speed signal integrity: SnpExpert and ViaExpert version 2014.02.

SnpExpert enables SI engineers to quickly explore the S-parameters in both frequency domain and time domain. SnpExpert 2014.02 solution provides quick single-ended and differential pair plot with PLTS style, enhanced TDR plot and built-in delay and skew calculator,  improved  S-parameter passivity/causality/reciprocity/stability analyzer,  built-in IEEE and OIF compliance, customized report generator in Word/PPT/Html format and one-click-for-all template plot

ViaExpert enables fast and accurate via modeling and simulation. In the latest release of ViaExpert, both 3D FEM solver and fast hybrid solver are deployed to achieve fast and accurate simulation.  In addition, ViaExpert 2014.02 release provides enhanced multi-core simulation performance, improved built-in connector footprint database, via array template, SMA model for quick pre-layout analysis and Allegro brd import for post-layout analysis. The customized parametric analysis is also supported in the new release.

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EPEPS 2014

Date:Oct 26-29, 2014.

Location: Portland, Oregon

Xpeedic Technology, Inc. will exhibit at EPEPS 2014 Portand, Oregon on Oct 26-29, 2014. Xpeedic will showcase EDA software, IPD and SiP solution. The EDA software tools enables fast electromagnetic modeling and extraction. The IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.
More details to see http://www.epeps.org/

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IMS 2014

Date:June 1-6, 2014.

Location: Florida

Xpeedic Technology, Inc. will exhibit at IMS 2014 in Tampa Bay, Florida on June 1-6, 2014. Xpeedic will showcase their EDA software, IPD and SiP solution in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS, iModeler, iVerifier, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designers and PDK engineers. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Visit Xpeedic at Booth #101 to find out more.

More details to see http://www.ims2014.org/

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Xpeedic to Exhibit at CSIA-ICCAD 2013

Xpeedic Technology, Inc. will exhibit at ICCAD 2013 in Hefei, Anhui Province, China on Oct 10-11, 2013. Xpeedic will show their EDA software and IPD IP in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS and iModeler, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designs. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Please visit Xpeedic at Booth #25-26 to find out more.

Dr. Wenliang Dai, VP of Engineering of Xpeedic, will present the following paper in Subject Forum (II).

Paper: 3D IC Integration with TSV EDA, IPD Chip, and SiP Technology
Presenter: Wenliang Dai, PhD
When: 13:00-13:25, Friday, Oct. 11, 2013
Where: Floor 3, Room 2, Anhui Int’l Convention and Exhibition Center

More detail…