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Xpeedic EDA Tools Selected to be in ICC EDA Platform

Shanghai, China. – December 24, 2015 – Xpeedic, a leading provider of EDA, IPD and SiP solution, today announced the partnership with Shanghai ICC (IC Industry Promotion Center).Xpeedic’s EDA flagship tools in high speed digital and RF IC designs are now part of ICC’s EDA service platform.

In order to promote the development of the IC design industry and to create a low-cost, low-risk design environment for the majority of design firms, ICC Shanghai has established an EDA software and hardware platform, providing SMEs with advanced software, hardware design verification environment, strict data security and sound technical support.

“On our platform, currently we only accommodate the software vendors with industry-proven and widely-adopted EDA solution such as the top three –Synopsys, Cadence and Mentor Graphics. The platform carefully selected two domestic EDA leaders and Xpeedic is one of them. It is for sure that cooperating with these EDA software companies, we will help more SMEs to adopt the world-leading solutions, ” said the leader at the ICC EDA platform.

“Rapidly growing data demand has driven the growth of mobile broadband, wifi, IoT, and cloud computing, fueling the development of network, devices, and applications. High speed communication link and RF front end designs, which directly contributes to the bandwidth of the data transmission, becomes more and more challenging because of the ever increasing data rate and frequency band allocation,” . said Dr. Ling, CEO of Xpeedic. ”Xpeedic’s RF IC and high speed SI solution provide a fast and accurate way to enable engineers to design with confidence, shorten the design cycle, and thus reduce the time to market. . With this partnership with ICC, we expect to help more domestic SMEs with the best tools and design the next generation electronic devices.

Xpeedic EDA modules included in ICC EDA platform are IRIS for RFIC passive extraction , SnpExpert for S-parameter exploration, ViaExpert for 3D Via Modeling and Simulation, and ChannelExpert for high speed channel exploration.

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Xpeedic Taiwan 2015 EDA Seminar is coming

Xpeedic Technology, Inc. will host an EDA seminar in Taipei, Taiwan on Oct.12, 2015.

High speed communication link design becomes more and more challenging because of the ever increasing data rate and the rapid development of semiconductor and IC technology. At multi-gigabit per second data rate, designers must characterize all the pieces in the signal path from transmit to receiver to address the signal integrity issues, including reflections, crosstalk, Simultaneous Switching Noise (SSN) and so on. Even a small discontinuity can significantly degrade the signal.

This seminar is targeting the SI engineers and to discuss fast and accurate way to model and simulate discontinuities along the path and optimize the channel performance. Xpeedic’s co-founder CEO Dr.Ling and VP engineering Dr. Dai will present within the seminar.

Detail agenda:

9:30-9:40 Welcome and Overview
9:40-10:10 S-parameter in high speed SI
10:10-10:40 Via modeling and optimization
10:40-11:00 Coffee/tea break
11:00-11:30 Impedance discontinuities from surface mounted pads
11:30-12:00 High speed channel modeling and optimization
12:00-13:00 Luck draw and Lunch

Venue: Conference center of National Taipei University of Technology
Contact: 02-2741-7655#201~202

If you have interest, please send email to Marketing@xpeedic.com for registration.

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EPEPS 2015

Date:Oct 25-28, 2015.
Location: San Jose, CA

Xpeedic to Exhibit at EPEPS 2015
EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.

Xpeedic will showcase its latest technology on EDA software, IPD and SiP solution. Xpeedic EDA software tools enables fast electromagnetic modeling and extraction. The IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

More details to see http://www.epeps.org/

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Xpeedic Exhibits at IMS 2015 and Organizes a Full Day Workshop on RF System Miniaturization

Suzhou, 2015.5.8

The IEEE MTT-S International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as plenty of opportunities to meet and network with friends both new and old. The symposium also hosts the largest RF/Microwave commercial exhibition in the world with over 550 Companies. The IMS 2015 will be held at Phoenix, AZ on May 17-22, 2015.

Dr. Feng Ling, CEO of Xpeedic, will organize a full-day workshop titled as “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies” on May 17, 2015. The workshop assembles a group of well recognized experts  from Xpeedic, Skyworks, STMicroelectronics, Amkor, ON Semi, STATSChipPAC, IPDiA, and Mentor Graphics to share with the IMS attendees their approach for RF front end miniaturization. The experts represents all the aspects of the entire RF ecosystem ranging from IPD/TSV/Package foundries, design houses, to EDA tool vendors. More details can be found at  http://www.ims2015.org/workshops/6-technical-program/technical-program-general-content/254-sunday-workshop-descriptions#WSK

Xpeedic is proud to be an Exhibitor at the IMS 2015 and can be seen at Booth #2612.

Xpeedic will also exhibit at Booth #2612, showcasing their EDA tools, IPD and SiP solution to enable the RF front end miniaturization. Its EDA tool suite IRIS/iModeler/iVerifier, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designers and PDK engineers. Its silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

About Xpeedic
Xpeedic is a global supplier of EDA software, IPD, and turn-key SiP design solution to enable today’s innovation in RF and high speed digital designs. More information about the company, its products, and services is available at http://www.xpeedic.com.

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IMS2015

Date: May 17-22, 2015
Location: Phoenix, AZ

Xpeedic Technology, Inc. will exhibit at the IEEE MTT International Microwave Symposium (IMS) at Phoenix, AZ on May 17-22, 2015. The IMS is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice.

Xpeedic will exhibit at Booth #2612.

Dr. Feng Ling, CEO of Xpeedic Technology, and Nozad Karim, VP of Electrical Engineering at Amkor, will be hosting a full day work shop of “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies”.

For additional information on the conference, visit http://www.ims2015.org/

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ICCAD 2014

Date:Dec. 11-12, 2014.

Location: Hong Kong

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2014 Annual Conference at Hong Kong on Dec. 11-12, 2014.
At Dec 12, Dr.Wenliang Dai, Engineering VP, will present the leading design method-“RFSiP Miniaturization by Integrated Passive Devices(IPD)” with IC industry companion in ICCAD Subject Forum 3.
At booth 1F#21-22,Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

The conference official  website:
http://www.csia-iccad.net.cn/
http://www.cicmag.com/bbx/856303-856303.html

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Xpeedic Announces Release of SnpExpert and ViaExpert 2014.02

Suzhou, China. —Sep. 30, 2014 —Xpeedic today unveils two enhanced solution in the area of high speed signal integrity: SnpExpert and ViaExpert version 2014.02.

SnpExpert enables SI engineers to quickly explore the S-parameters in both frequency domain and time domain. SnpExpert 2014.02 solution provides quick single-ended and differential pair plot with PLTS style, enhanced TDR plot and built-in delay and skew calculator,  improved  S-parameter passivity/causality/reciprocity/stability analyzer,  built-in IEEE and OIF compliance, customized report generator in Word/PPT/Html format and one-click-for-all template plot

ViaExpert enables fast and accurate via modeling and simulation. In the latest release of ViaExpert, both 3D FEM solver and fast hybrid solver are deployed to achieve fast and accurate simulation.  In addition, ViaExpert 2014.02 release provides enhanced multi-core simulation performance, improved built-in connector footprint database, via array template, SMA model for quick pre-layout analysis and Allegro brd import for post-layout analysis. The customized parametric analysis is also supported in the new release.

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EPEPS 2014

Date:Oct 26-29, 2014.

Location: Portland, Oregon

Xpeedic Technology, Inc. will exhibit at EPEPS 2014 Portand, Oregon on Oct 26-29, 2014. Xpeedic will showcase EDA software, IPD and SiP solution. The EDA software tools enables fast electromagnetic modeling and extraction. The IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.
More details to see http://www.epeps.org/

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IMS 2014

Date:June 1-6, 2014.

Location: Florida

Xpeedic Technology, Inc. will exhibit at IMS 2014 in Tampa Bay, Florida on June 1-6, 2014. Xpeedic will showcase their EDA software, IPD and SiP solution in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS, iModeler, iVerifier, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designers and PDK engineers. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Visit Xpeedic at Booth #101 to find out more.

More details to see http://www.ims2014.org/

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Xpeedic to Exhibit at CSIA-ICCAD 2013

Xpeedic Technology, Inc. will exhibit at ICCAD 2013 in Hefei, Anhui Province, China on Oct 10-11, 2013. Xpeedic will show their EDA software and IPD IP in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS and iModeler, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designs. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Please visit Xpeedic at Booth #25-26 to find out more.

Dr. Wenliang Dai, VP of Engineering of Xpeedic, will present the following paper in Subject Forum (II).

Paper: 3D IC Integration with TSV EDA, IPD Chip, and SiP Technology
Presenter: Wenliang Dai, PhD
When: 13:00-13:25, Friday, Oct. 11, 2013
Where: Floor 3, Room 2, Anhui Int’l Convention and Exhibition Center

More detail…