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Xpeedic to Exhibit at EDI CON China 2016

Date: Apr 19-21, 2016.
Location: Beijing, China
Booth: 432

EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

More details to see http://ediconchina.com/default.asp

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SMIC 2014 Technology Symposium in Shanghai

Date: Sept. 18, 2014.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.

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Xpeedic At IEEE EDAPS 2011

Suzhou, China — Nov. 28, 2011
 
Xpeedic Technology, Inc. will at IEEE EDAPS 2011, being held at Hangzhou, China on Dec. 12-14, 2011. Feng Ling, Founder/CEO of Xpeedic Technology, Inc. will organize a special workshop “EDA Solution for Chip, Package, and Board Designs”. Leading EDA vendors will present their solutions on various topics including TSV modeling, SI/PI simulation, co-simulation, and channel analysis. Dr. Wenliang Dai, VP of Engineering of Xpeedic Technology, Inc.,  will deliver the speech titled “Enabling Optimal Channel Performance by Interconnect Tuning”.