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Xpeedic to Exhibit at WSC2019

日期:2019年5月17-19日
地点:南京,国际博览会议中心
展位号:E1

2019世界半导体大会暨第十七届中国半导体市场年会即将于5月17-19日在南京国际博览会议中心开幕。

本届大会以创新协作、世界同“芯”为主题,全方位展示半导体产业的发展动态和最新成果,促进积极有效的交流合作;大会将采用“2+N+1”的举办模式,举办2场主论坛(高峰论坛和创新峰会),N场专题论坛/专题活动以及1场专业展会;大会还将公布“第十三届(2018年度)中国半导体创新产品和技术项目”,发布《世界半导体市场趋势展望白皮书》、《中国半导体产业发展状况白皮书》等相关评选结果与专题报告。

芯禾科技在本届大会上将主要展示其EDA/IP整合解决方案的最新研发成果,包括EDA设计仿真工具、无线射频IPD集成无源器件和SiP系统级封装服务的三大产品线。

WSC2019-2

WSC2019-1

现场演讲:

大会期间,芯禾科技还将在本次大会上带来两篇论坛演讲,分别是

EDA Enablement for RF- and FD-SOI

  • SOI论坛
  • 5/18 15:55
  • CEO 凌峰博士

《仿真驱动EDA解决方案助力先进IC-封装-系统设计》

  • EDA/IP设计服务论坛
  • 5/18 16:00
  • 副总裁 代文亮博士

大会的详细日程安排如下:

日程表
扫描二维码报名参会
报名二维码

Xpeedic to Exhibit at ICCAD 2018

Date: Nov.29-30, 2018

Location: Zhuhai, China

Booth#: 003-004

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2018 Annual Conference & Zhuhai IC Industry Innovation and Development Summit (ICCAD 2018) in Zhuhai on Nov.29-30, 2018.

ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain to exchange their expertise and to build up networks. This year, the theme is “Linking Core Power, Leading intelligence of the Great Bay Area”. In this annual general meeting, the Integrated Circuit industry, especially the opportunities and challenges faced by the IC Design industry, will be discussed in details in order to enhance innovation capability and improve the comprehensive capability of Chinese Integrated Circuit industrial chain, thereby satisfying the market demands and boosting international competence.

At booth 003-004 , Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

Dr. Wenliang Dai, co-founder, VP Engineering, will also present the leading design method “Addressing Modeling and Simulation Challenges for IC, Package and System” within EDA and IC Design Service forum on Nov.30.

For more details, please click here.

XTUG 2018

亲爱的工程师伙伴,

2018年的上半年,社会对于拥有质量过硬的“中国芯”的呼吁之声达到了产业发展有史以来的最高点。我们都知道,在一块芯片制造出来之前,芯片设计尤为重要,而芯片设计的根基则是电子设计自动化(EDA)软件。我们从未对国产高质量EDA软件产生过如此迫切的需求。

2018年9月20日,国内EDA、IPD、SiP行业的领军企业芯禾科技一年一度的用户大会XTUG(Xpeedic Technology Users Group)将秉承一贯的传统, 再次跟您相会。这不仅是一场知识碰撞的盛会、经验交流的盛会、战略共享的盛会,也是一场对于多年来一直支持和信任芯禾科技的新老用户和有识之士的答谢盛宴,我们发展的路上感谢有您的陪伴!

诚邀您莅临上海博雅酒店,与芯禾科技高层领导、技术专家、生态系统合作伙伴以及行业客户菁英一起,畅享行业智慧,探讨“中国智能时代”的设计创新。

活动安排

  • 时间:2018年9月20日
  • 地点:上海博雅酒店——浦东新区张江碧波路699号(近晨晖路) 碧波厅
  • 交通:地铁二号线张江高科站5号出口
  • 日程*:

*具体内容以大会实际安排为准

虚位以待,唯待君来。XTUG2018,我们不见不散!

Xpeedic to Exhibit at EDI CON China 2016

Date: Apr 19-21, 2016.
Location: Beijing, China
Booth: 432

EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

More details to see http://ediconchina.com/default.asp

SMIC 2014 Technology Symposium in Shanghai

Date: Sept. 18, 2014.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.

Xpeedic At IEEE EDAPS 2011

Suzhou, China — Nov. 28, 2011
 
Xpeedic Technology, Inc. will at IEEE EDAPS 2011, being held at Hangzhou, China on Dec. 12-14, 2011. Feng Ling, Founder/CEO of Xpeedic Technology, Inc. will organize a special workshop “EDA Solution for Chip, Package, and Board Designs”. Leading EDA vendors will present their solutions on various topics including TSV modeling, SI/PI simulation, co-simulation, and channel analysis. Dr. Wenliang Dai, VP of Engineering of Xpeedic Technology, Inc.,  will deliver the speech titled “Enabling Optimal Channel Performance by Interconnect Tuning”.