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Automated Crosstalk Scan, Impedance Scan and DRC+ for Signal Integrity Signoff

Crosstalk analysis for high speed PCB design becomes more and more important due to the high data rate and tightly coupled routing. Traditional circuit-based analysis can not meet the accuracy demand. Three-dimensional (3D) full-wave electromagnetic solver is required to capture the complex 3D PCB environment and the frequency-dependent phenomena. This paper introduces a novel hybrid solver technology with both speed and accuracy. Crosstalk metrics to quantify the crosstalk level are also developed by post-processing S-parameter. Combining these two techniques allows designer to achieve full board crosstalk in a few hours as planned, which significantly reduces the post-layout check time and ensure timely sign-off.

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Fast and Accurate Fiber Weave Modeling and Simulation

As the data rate of SerDes channel increases from 25Gbps to 56Gbps and 112Gbps, the requirement for timing skew of differential signals is becoming tighter and tighter. The skew of differential pairs can be introduced by the unbalanced differential trace routing on glass weaves. In high-speed PCB designs, there are many possible combinations considering different glass weave patterns and different trace routings, which makes quantifying the impact of glass weave on skew a challenging task. It requires electromagnetic simulation tool vendor to come up with the design guideline for PCB engineers.

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Accurate Dk/Df Extraction for High-speed SI Applications

This application note presents an accurate way to perform dielectric constant (Dk) and dielectric loss (Df) extraction over a wide range of laminate materials for high-speed SI applications. The Through-Only De-embedding (TOD) method with optimization is used for this Dk/Df extraction. The resultant frequency dependent material models is ready to be used in electromagnetic simulation tools in market.

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IEEE P370 Compatible De-embedding and Quality Check for Measured S-parameters up to 50Ghz

This application note presents an IEEE P370 compatible and competitive de-embedding and quality check method for measured S-parameters up to 50Ghz in SnpExpert, which gives SI engineers a fast and easy way to post-process and assess S-parameters.

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Combined IRIS-HFSS Flow for Passive Modeling and Verification in TowerJazz RF and HPA Nodes

This application note presents a combined IRIS-HFSS flow for passive modeling and verification in TowerJazz RF and HPA nodes, which gives IC designers not only the fast and accurate passive modeling and synthesis capability at the design stage, but also the verification capability at the sign-off stage.

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Full Board

Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

Abstract—Crosstalk analysis for high speed PCB design becomes more and more important due to the high data rate and tightly coupled routing. Traditional circuit-based analysis can not meet the accuracy demand. Three-dimensional (3D) full-wave electromagnetic solver is required to capture the complex 3D PCB environment and the frequency-dependent phenomena. However it is prohibitively expensive to simulate the practical large board cases and the resultant tabulated S-parameter cannot be directly used to quantify the crosstalk level. This paper introduces a novel hybrid solver techniques with improved speed and accuracy. The new crosstalk metrics to quantify the crosstalk level are also developed by post-processing S-parameter. Combining these two techniques allows designers to achieve full board crosstalk in a few hours as planned intended with using the tool, which significantly reduces the post-layout review time, allows layout optimization and ensures a timely sign-off.

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Foamed Cable

An Empirical Model for Foamed High-Speed Cable

Abstract—As the foaming technology becoming widely adopted for high-speed cable, the challenge of modeling the generic foaming which is a combination of skin and foam structure becomes critical for both cable design and channel analysis. An empirical model is proposed and validation with measurements are presented in this paper for targeted applications.

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