From chip, module to system,
enabling RF system-level co-optimization 

Overview

The rapid growth of smartphones, AIoT, AR/VR, EV and UAVs is providing sustained momentum for the RF market, driving innovations in RF front-end, wireless communication, and antenna technologies. While requirements for RF systems are becoming differentiated across different application scenarios:

•  Higher integration in Smartphones for 5G/6G with multi-mode/multi-band operation and Carrier Aggregation.

•  Higher frequency bands, such as mmWave for AR/VR and automotive radar.

•  Ultra-low power for Edge AI and AIoT devices.

•  Higher-dynamic tracking capabilities for UAVs with beamforming and phased array antennas.

RF system design is moving toward higher frequencies, multi-mode functionality, intelligence, and lightweight integration.Driven by these emerging requests, RF design—from chip to system—is facing unprecedented challenges at every hierarchy.

RF IC Level: As process nodes continue to shrink while bandwidth increase, passive interconnects are occupying a significant portion of RF IC design. The structural diversity and applications for on-chip passives—such as capacitors, inductors, transformers, and coplanar waveguides—have become highly complex.

To accurately capture the resulting parasitic effects and intricate coupling behaviors, high-precision electromagnetic simulation has become mandatory.

RF Terminal Level: The transition from 4G to 5G has led to a multi-fold increase in the number of supported frequency bands, extending RF tuning and debugging cycles by a factor of 3 to 5, and drastically increased architectural complexity.

This complexity makes automated modeling and simulation for modules much more difficult, placing much higher demands on EDA tools.

Antenna level—specifically in AoP and board-level designs—challenges regarding miniaturization, heterogeneous integration, and EMC are increasingly prominent. Engineers must perform high-precision simulation of both near-field and far-field radiation characteristics.

Furthermore, EM simulation is essential to optimize the complex coupling, radiation, and interference profiles of miniaturized arrays in high-density configurations, ensuring robust system-level connectivity and stability.

To address these multi-layered challenges, Xpeedic RF EDA solution delivers comprehensive simulation capabilities across the entire “chip–module–system” continuum. It enables system-level co-optimization by integrating device modeling, EM simulation, near/far-field radiation analysis, field-circuit co-simulation, and system verification.

This empowers designers to accurately evaluate performance at the earlier design stages, shorten tuning cycles, and significantly enhance overall development efficiency. 

Solution

Key Features

Design Scenarios

RF package EM simulation