Memory EDA solution across chip-package-module-board-system. 

Overview

To sustain the high-speed processing demands of AI, systems require not only high-performance compute chips but also robust storage media capable of hosting massive datasets. Memory technology is evolving toward higher bandwidth and lower power consumption. In the realms of HPC and AI accelerators, high-bandwidth memory (HBM) has become a de facto standard for GPUs and AI chips.

Simultaneously, Flash is iterating to achieve higher capacities and throughput; 3D NAND layer counts continue to break records, significantly improving storage density and cost-efficiency. In enterprise environments, NVMe storage has largely superseded traditional SATA/SAS interfaces, further advancing storage performance boundaries.

The full potential of both RAM and Flash depends on high-speed interconnect technology, with protocols like PCIe and CXL seeing rapid adoption. Furthermore, storage design methodology has shifted from "local optimization" to "end-to-end co-design." By integrating device-level, package/board-level, and system-level design with multi-physics co-optimization, this approach provides the technical foundation for next-generation memory-compute integrated architectures.

1. SI Pressures: LPDDR6 rates have reached 14.4 GT/s in JESD209-6, andNVMe SSD protocols now demand microsecond-level latency. These extreme speeds exacerbate channel loss, reflections, and crosstalk, making high-precision modeling and simulation mandatory to guarantee channel integrity.

2. The Thermal-Signal Dilemma: Massive 3D NAND stacking leads to a rapid spike in power density. Poor heat dissipation can cause component warping and structural stress. Additionally, complex vertical interconnects between layers often result in signal delay and synchronization skew, requiring a coupled optimization of thermal, stress, and signal factors.

3. Power Delivery Reliability: Memory technologies such as DDR6 are entering an era of low voltage and high current, with increasingly stringent requirements for current ripple and transient response. This necessitates multi-physics coupled PI simulations to ensure storage system stability.

Xpeedic provides a comprehensive memory EDA solution covering the entire "Chip-Package-Module-Board-System" continuum. Targeting frontier applications such as AI, Big Data, Cloud Computing, Edge Computing, and On-device computing, the solution provides full-flow enablement—from concept to mass production—for the next generation of high-speed, high-frequency intelligent electronics.

Solution

Key Features

Design Scenarios

DDR package modeling and simulation