Smart terminal simulation solution
from chip, package, PCB to system

Overview

As emerging technologies—including AI, advanced packaging, edge-to-cloud synergy, and ecosystem integration—continue to mature, upgrade cycles for terminal products such as smartphones, wearables, drones, and tablets are accelerating.

The current upgrade path for smart terminals centers on the integration of dedicated AI accelerators to support increasingly complex on-device model inference. Simultaneously, to achieve higher levels of integration and performance, these terminals are densely packing critical components—such as HPC SoCs, high-speed memory, and PMICs—further deepening the shift toward heterogeneous computing architectures.

Under this trend, smart terminals are moving toward miniaturization and heightened intelligence, while continuously breaking through in multi-terminal form factors, cross-device connectivity, and multi-ecosystem integration. The industry is fundamentally shifting from a hardware-centric competition to an end-to-end experience upgrade centered on software and services.

1. SI Challenges: Timing margins are shrinking dramatically when high-speed interfaces reach GHz levels,. The complexity of SI modeling increases significantly due to reflections at impedance discontinuities—such as vias and connectors—as well as intricate interconnects within the package.

2. PI Challenges: As smart terminals evolve toward miniaturization, higher power consumption, and low-latency applications, systems must handle aggressive dynamic currents reaching tens of Amps within nanoseconds. These surges cause severe core voltage drop and trigger Simultaneous Switching Noise (SSN). Meanwhile, managing increasingly granular multi-voltage domains has become highly complex; designing a Power Delivery Network that meets target impedance requirements into the GHz range is exceptionally difficult. It requires the dense placement of high-performance decoupling capacitors across the chip package and PCB to ensure stable power delivery under transient loads.

3. Thermal Design Challenges: Power density has skyrocketed, creating localized hotspots within confined spaces, with the rising concentration of computing power. The limited physical volume of mobile devices further restricts heat dissipation. Therefore, developing high-efficiency thermal interface materials and optimizing heat dissipation paths is critical to preventing thermal throttling and degradation of overall system reliability. Furthermore, as smart terminals integrate multiple communication protocols across various frequency bands, high-power operation increases the risk of EMC risks, necessitating a co-optimization approach between thermal and electromagnetic design.

To address the complex challenges inherent in smart terminal design, Xpeedic offers an end-to-end simulation solution that provides comprehensive analysis across the entire lifecycle—from chipand packaging design to board-level circuit and system validation. This integrated workflow empowers designers to identify and mitigate technical risks during the earlier stages of product development, optimizing performance, ensuring long-term reliability, and accelerating time-to-market.

Solution

Key Features

Design Scenarios