Cross-hierarchy co-design and multi-physics analysis from chip,interposer to package,
addressing high-speed interconnect, bandwidth bottleneck, and power density challenges.

Overview

In the era of AI, high-performance computing continues to grow exponentially, while Moore's Law is approaching its physical limits, and the marginal performance gains from transistor scaling are diminishing.

Under the constraints of power, area and cost, traditional SoCs are struggling to meet the rigorous requirements of computational density, memory bandwidth, and power efficiency in AI era.

Against this backdrop, Chiplet-based advanced packaging—enabled by heterogeneous integration and 3D stacking—has emerged as a transformative path forward. By vertically integrating Dies built on different process nodes and optimized for distinct functions, it enables system-level miniaturization and performance gains.

Meanwhile, the widespread adoption of next-generation high-bandwidth memory interfaces, such as HBM3/4, within advanced packaging has significantly boosted data throughput. Simultaneously, high-speed optical interconnect solutions like CPO are providing revolutionary, low-latency, ultra-high-bandwidth communication channels for AI servers and data centers.

These frontier technologies are becoming the primary drivers for the rapid deployment of advanced packaging, shifting the chip design paradigm from single-die optimization toward a new era of "Chip-System Co-Design." Under this trend, EDA design workflows are confronting unprecedented challenges.

1. The introduction of multi-chiplet architectures and high-speed interfaces like HBM3/4 has caused massive SI and PI issues. Increased operating frequencies and power densities request precise, cross-chip simulation and optimization during the early design stages to decrease the risk of performance bottlenecks surfacing post-tape out.

2. 2.5D/3D advanced packaging and high-density optoelectronic interconnect technologies, such as CPO, have significantly increased routing complexity and interconnect density. Engineering phenomena—including EMI between high-speed differential pairs, thermal accumulation within the package, and CTE mismatch—ask for higher precision and solver speeds from EDA tools.

3. Lack of chip-package co-design capabilities as a critical bottleneck in traditional EDA prevents the unified multi-physics analysis—including thermal,stress, and electromagnetics—within a single platform.

To address all these challenges, Xpeedic Chiplet-based advanced packaging design platform has built a comprehensive solution covering the entire heterogeneous integration workflow. This approach establishes a seamless co-design and analysis across multiple hierarchies—from silicon and substrates to the final package.

The core breakthrough lies in advanced multi-physics co-simulation capabilities. It not only supports interconnect analysis for massive data channels alongside SI/PI analysis, but also deeply integrate electrical, thermal, and stress simulations to achieve close-loop optimization for system-level performance and reliability.

This methodology directly addresses the primary pain points of Chiplet design by upgrading traditional, siloed chip design and packaging simulation workflows into a STCO flow, which significantly reduces design iteration costs and accelerates time-to-market.

Solution

Key Features

Design Scenarios

2.5D Interposer Routing