Multi-physics co-simulation from package, 
board to system, addressing high speed interconnects,
PDN and thermal challenges in data centers. 

Overview

Data centers serve as critical infrastructure, providing highly reliable and secure operating environments for HPC and AI workloads, backed by robust maintenance and service ecosystems.Far beyond mere physical spaces, they act as the nerve center for data storage, exchange, and computation, forming the foundation for cloud computing, big data, AI, 5G, and satellite communications.

Data centers are undergoing a systemic transformation: distributed full-mesh architectures are breaking traditional network hierarchies to achieve ultra-high-density interconnects between racks; the evolution of SerDes speeds is continually doubling single-channel transmission capacity to support next-generation high-speed signaling; and the scaling of GPU clusters from thousands to tens of thousands—driven by disaggregated memory-compute architectures and ultra-low latency networks—provides the necessary horsepower for generative AI.Under these emerging trends, data center system design is confronting critical challenges:

1. Signal Integrity: System architectures are transitioning toward high-speed cabling and advanced connectors, as traditional PCB traces approach physical limits.

2. Power Integrity: The explosion of computing power has pushed traditional low-voltage delivery to a breaking point. HPC chips are consuming significantly more power at lower operating voltages, forcing data centers to overcome power integrity bottlenecks caused by low-voltage, high-current delivery.

3. Thermal Stability: With chip power consumption soaring, traditional air cooling can no longer maintain required junction temperatures. There is an urgent need to overhaul thermal architectures while mitigating engineering risks.

Solution

Key Features

Design Scenarios