Time：Feb 24-26

Place：Santa Clara Convention Center, Santa Clara, CA

Booth：627

Overview

Xpeedic will showcase its latest simulation EDA solutions at the DesignCon2026 in Santa Clara, Feb 24-26. This will mark Xpeedic's 13th consecutive participation in DesignCon.

Xpeedic's simulation EDA from chip to system covers chip, package, module, PCB, interconnection and system. The spotlight will be on its latest solutions, featuring advancements in Advanced Packaging, RF, Power Devices, Data Center, and Memory EDA.

Technical Session

Xpeedic will co-publish a technical paper at DesignCon2026. Details are as follows:

Fast Signal Integrity Simulation and Optimization for LPDDR5x at 10.7 Gbps in AIPC

• Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation
• Author: Zhijian Mo, Huaqiao Li, Zhengyi Zhu, Mingjie Fang (Lenovo),Guangmeng Ji, Yufeng Dan, Zhenzhen Tang, Wei Fu, Guodong Wang, Ting Kang, Yongpeng Liu (Xpeedic)
• Time: February 25, 12:15PM-1:00PM Pacific Time
• Location: Ballroom D

Resources Downloads

Click the images above to download files

Meet with Xpeedic

We would love to see you there and discuss how our solutions can support you.

Please signup if you can attend:

• Thursday, February 26, 11:00 a.m. - 6:00 p.m. 
• Wednesday, February 25, 11:00 a.m. - 6:00 p.m.