Time：Aug 3-7, 2026

Place：Sheraton Dallas Hotel, Dallas, Texas

The 2026 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI 2026) will be held August 3–7 in Dallas, Texas. Xpeedic will chair Workshop04 and present at two workshops at this year's symposium.

Workshop 04

• Title: Advances in Signal and Power Integrity Analysis for Multi-Die 2.5D/3D IC Designs
• Time: Friday, August 7, 8:30 AM – 12:00 PM
• Location: Coronado A
• Chair&Speaker: Dr. Feng Ling, President of Xpeedic
• Introduction: Examines the signal and power integrity challenges arising from dense interposers, through-silicon vias, micro-bumps, and ultra-short die-to-die interconnects in 2.5D/3D packaging, and presents modeling and simulation approaches to address them.

Workshop 07

• Title: Benchmark of Interconnects in Multi-Die Heterogeneous Integration System
• Time: Friday, August 7, 1:30 PM – 5:00 PM
• Location: Coronado A
• Speaker: Dr. Feng Ling, President of Xpeedic
• Introduction: Covers benchmark models for interconnects in multi-die heterogeneous integration, focusing on practices for validating simulated results against measured data.