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HERMES 3D – 3D EM Simulation for Package and Board Designs


Background

With the pressure of high quality, low cost, and quick time to market for new product development, the computer's powerful storage capacity, fast processing speed and interactive interface graphics capabilities have become a good way to realize the automation of complex engineering designs, which can speed up the product development cycle and reduce costs. Modern high-frequency (MW/RF/HSD) designs are increasingly limited by space (maximize the IC production with limited area, reduce product size, increase functions in small packages, etc.), FCBGA, WBBGA , System-in-package (SIP), stacked chips, package-on-package (POP), multi-chip modules, etc. are becoming more and more common. It is necessary to accurately analyze the parasitic interaction within and between IC, package and circuit board interconnections. Hermes 3D solution launched by Xpeedic solves these issues well and introduces a very simple and easy-to-use analysis process to help designers evaluate their designs. Hermes 3D accurately simulates the three-dimensional models based on the finite element algorithm (FEM), which can quantitatively analyze the interactions between interconnection parasitic parameters.


Overview

Xpeedic Hermes 3D uses accuracy mesh technology for the finite element method solver. The initial mesh (dividing the geometry into tetrahedral units) is based on the geometric structure. The initial mesh can be used to quickly solve and provide field solution information, and then the mesh is refined only in the essential area. The iterative solution technology saves computing resources and obtains maximum accuracy. When necessary, manual meshing can also be conveniently used to guide and optimize the solution for accelerating mesh refinement. Three-dimensional full-wave high-precision electromagnetic solver (FEM3D Solver) can cover the simulation frequency from DC to THz, which can fully meet the requirements of high-frequency applications, and can perfectly support cross-scale analysis from nanometer to centimeter level; Hermes 3D's powerful parametric sweeping function performs hypothesis analysis by sweeping the property parameters of pad, stack, routing layer and back-drill hole depth. Hermes 3D can efficiently and accurately extract interconnection S- parameters, and optimize the design by adjusting the routing length, width, spacing, pad, lamination and other physical parameters. Hermes also provides the function of exporting to HFSS. The output file format includes a vbs script that can edit the model structure and a python script that can be quickly imported, users can choose them to quickly build a model.




Main Features

  • Support different package types, including WireBond (QFP/QFN/WB/BGA), FlipChip (FCBGA/FCCSP) and 2.5D/3D packages (MCM/3D-FOP/INFO). integrated process of importing designs, design stacking, automatically adding ports and simulation of various layout design files.

  • Support 2D edit function, convenient for users to modify the layout, including shape Boolean operations, adding/moving/deleting vias.

  • Support dxf file (leadframe) importing, QFN and QFP package can be created from imported dxf files.

  • Support automatic setting of electromagnetic boundary and parameter sweeping, including but not limited to material thickness, trace width, medium characteristic parameters, etc.

  • Support conversion of S parameter / Y parameter / Z parameter and frequency-based RLGC file format.

  • Advanced three-dimensional electromagnetic solver engine (FEM3D Solver), covering DC-THz high-precision and fast simulation, and supports cross-scale simulation from nanometer to centimeter level.

  • Mesh Tunneling technology for adaptive meshing, ensuring the accuracy of heterogeneous structure, and greatly improving simulation efficiency.

  • Two simulation modes ("Accuracy" and "adaptive") help users quickly switch mesh and FEM3D Solver settings according to simulation requirements, which is ease of use.

  • Support advanced layout repair function, automatically repair the sharp corners after cutting, providing a more stable and friendly simulation structure for simulation.

  • Mesh and 3D structural checking to avoid simulation issues.

  • One-click export file to HFSS, automatically create 3D models, airbox, materials, laminations, incentives, simulation boundaries and frequency settings.


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