时间：2026年1月19-22日

地点：香港迪士尼酒店

芯和半导体科技（上海）股份有限公司（以下简称“芯和半导体”）将于1月19-22日参加在香港举办的亚洲及南太平洋设计自动化会议 ASP-DAC 2026。作为国内Chiplet先进封装EDA的代表，芯和半导体的温继敏博士将于Designer Forum Session中发表题为《AI for EDA: Chiplets Simulation New Era》的主题报告。

活 动 简 介

主 题 报 告

• Session 8D：Chiplets Go Mainstream: Design Automation for 2.5D/3D Systems
• 演讲主题：Al for EDA: Chiplets Simulation New Era
• 演讲人：芯和半导体温继敏博士
• 演讲时间：1月22日, 14:20-14:45
• 演讲简介：As 2.5D/3D Chiplet technology becomes the driver for performance scaling, multi-physics simulation bottlenecks impede design closure. This session introduces XAI, a full-stack multi-agent platform designed to address these challenges in heterogeneous integration. We will demonstrate XAI.Sim, which leverages Physics-Informed AI to accelerate thermal analysis for dense 3D stacks by 100x-1000x , and XAI.Opt, which utilizes surrogate modeling to optimize high-speed die-to-die interconnects. By integrating these with the XAI.Copilot automation engine , we present a pathway to automated, intelligent System Technology Co-Optimization (STCO).

大 会 链 接

点击这里，进入大会官网查看大会详细议程并报名注册。