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    IC Solution
    IRIS – RFIC Passive Extraction
    iModeler – Passive PDK Model Generation
    iVerifier – Passive PDK Verification
    Package Solution
    HERMES 3D – 3D EM Simulation for Package and Board Designs
    Metis – Fast EM Simulation for Advanced 2.5D/3D Packaging
    System Solution
    ChannelExpert – Channel Exploration
    Notus - PI/SI/Thermal Analysis Platform
    XDS – Xpeedic RF Design and Simulation Platform
    SnpExpert – S-parameter Exploration
    ViaExpert – Via Modeling and Simulation
    TmlExpert – TML Modeling & Simulation
    CableExpert – Fast and Accurate Cable Modeling and Simulation
    Heracles – Automated SI Signoff for High Speed Design
    Genesis - New Board-level System EDA Platform
    Cloud Solution
    JobQueue – Simulation Job Queue System
    LibManager – Library Management Platform
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Results
  • ChannelExpert: High Speed Channel Exploration 2022-09-10
  • Hermes 3D: High Speed PCB Signal Integrity Analysis 2022-09-10
  • Heracles: Automated SI Signoff for High Speed Design 2022-09-09
  • Channel Analysis Flow In High Speed Digital Design 2022-05-06
  • Xpeedic Releases High Speed EDA Solution 2021 2021-08-19
  • Heracles – Automated SI Signoff for High Speed Design 2020-05-11
  • Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs 2018-08-09
  • Signal integrity in high speed digital design 2016-11-03
  • Lenovo Adopts Xpeedic High Speed SI Solution 2016-09-07
  • Xpeedic Announces Major Release of its High Speed SI and RFIC EDA Tools 2016-01-15

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Logo Xpeedic Takes 2023 3D InCites Herb Reiter Design Tool Provider of the Year Award

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